Effects of Surfactants and Surface Treatment on Aqueous Dispersion of Silicon Carbide

Meguro, Kenjiro; Ushida, Takahisa; Hiraoka, Tetsuya; Esumi, Kunio

doi:10.1246/bcsj.60.89

Cited by 19 publications

(10 citation statements)

References 10 publications

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“…However, Helle also showed that these fluorocarbon surfactants produced a dramatic increase (up to 50%) in particle content for inorganic particles, like SiC and diamond. This increase in particle content was confirmed by Meguno et al [51], who found twice as much SiC particles embedded in a Ni-matrix if a nonionic surfactant was used. By using a surfactant, Chang and Lee [10] produced nickel deposits containing about five times as much A1203 particles, while using particle concentration about ten times as low as in experiments without surfactants [8,19,29].…”

Section: ) 9usupporting

confidence: 64%

“…Meguno et al [51] confirmed the suggestions of the earlier researchers by measuring C, which is a quantitative measure for the particle surface charge [31]. At high pH ~ of c>SiC and -y-SiC is negative, but it increases with decreasing pH and becomes positive at low pH.…”

Section: Surface Chargementioning

confidence: 53%

“…If they act as cationic surfactants, they promote codeposition. Correspondingly, some wetting agents or brighteners reduce codeposition by acting as anionic surfactants, conferring a negative charge on the particles [51].…”

Section: ) 9umentioning

confidence: 99%

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Electrochemical codeposition of inert particles in a metallic matrix

1995

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A survey on electrochemical codeposition of inert particles in a metallic matrix is given. Particles held in suspension in an electroplating bath are codeposited with the metal during electrodeposition. The particles used are inert to the bath and can be of different types, that is, pure metals, ceramics or organic materials. Combining this variety of types of particles with the different electrodeposited metals, electrochemical codeposition enables the production of a large range of composite materials with unique properties. Many experimental factors were found to influence the codeposition process, which led to some understanding of the mechanism. Models to predict the codeposition rate were developed, but were only partly successful.

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Section: ) 9usupporting

confidence: 64%

Section: Surface Chargementioning

confidence: 53%

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Electrochemical codeposition of inert particles in a metallic matrix

1995

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“…The coating composition depends on factors related either to the particles such as size, density, composition, zeta potential and conductivity [10][11][12][13][14], or to the electrolyte such as composition, pH, temperature, current density, stirring speed and surfactants [15][16][17][18][19][20]. The effect of surfactant has been studied infrequently.…”

Section: Introductionmentioning

confidence: 99%

Effect of surfactant BAS on MoS2 codeposition behaviour

Wang

2007

J Appl Electrochem

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Ni-MoS 2 metal matrix composites were produced by electrodeposition in a Watts bath. The correlation of embedded particle ratio and operational parameters was studied. When surfactant BAS was adsorbed on the MoS 2 particle surface, the conductivity of the MoS 2 was significantly decreased. Thus, more Ni atoms may be deposited homogeneously over a wider area rather than on preferred conductive positions. This results in a smoother codeposition layer with lower porosity. Furthermore, strong adhesion between the codeposition layer and the substrate when using surfactant BAS may result from lower porosity of the codeposition layer.

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“…SiC particles is in the vicinity of pH 2.2 [21,23]. Even though the PZC values can be different in a plating bath than in a diluted electrolyte, the general tendency remains the same, i.e., the charge of particles becomes more positive with the decrease of pH.…”

Section: Effect Of Phmentioning

confidence: 95%

Electrodeposition of Co–Mn3O4 composite coatings

Apelt

Zhang

Zhu

et al. 2015

Surface and Coatings Technology

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Electrolytic codeposition was employed as a low-cost alternative process to fabricate composite coatings containing Mn 3 O 4 particles in a Co matrix for potential applications in solid oxide fuel cells. The effects of codeposition parameters on the Mn 3 O 4 particle incorporation, cathode current efficiency, and coating uniformity were investigated using a Design of Experiments (DoE) approach. Concentration of Mn 3 O 4 particles in the plating solution, agitation rate, current density, and solution pH were the four factors considered in the fractional factorial 2 (4-1) design. With different combinations of the deposition parameters, the amount of Mn 3 O 4 particles incorporated in the composite coatings ranged from 0 to 12 vol.%. The DoE results indicate that the pH of the plating solution exhibited the greatest importance on both particle incorporation and current efficiency, which were decreased significantly below pH 2. The Mn 3 O 4 concentration in the plating bath showed the second strongest effect on particle incorporation, followed by the agitation rate. While the applied current density did not appear to affect the Mn 3 O 4 particle incorporation, it had a strong influence on coating thickness uniformity.

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Effects of Surfactants and Surface Treatment on Aqueous Dispersion of Silicon Carbide

Cited by 19 publications

References 10 publications

Electrochemical codeposition of inert particles in a metallic matrix

Electrochemical codeposition of inert particles in a metallic matrix

Effect of surfactant BAS on MoS2 codeposition behaviour

Electrodeposition of Co–Mn3O4 composite coatings

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