2012
DOI: 10.1143/jjap.51.05ee05
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Effects of Temperature and Current Stressing on the Intermetallic Compounds Growth Characteristics of Cu Pillar/Sn–3.5Ag Microbump

Abstract: The mechanical and electrical reliability of Cu/Sn–3.5Ag microbumps under both annealing and current-stressing conditions were systematically evaluated. Intermetallic compound (IMC) growth was controlled by a diffusion-dominant mechanism and a chemical reaction-dominant mechanism with annealing and current-stressing time, respectively. The transition time for IMC phase change had an inverse relationship with current density because of the electron wind force under current stressing conditions. The shear streng… Show more

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Cited by 6 publications
(6 citation statements)
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“…7(b) [10]. Remained solder phase was completely consumed because the atomic rearrangement to form the Cu 6 Sn 5 phase of the regular structure occurs at the Cu/solder interface [17]. Kirkendall void is formed along Cu 3 Sn/Cu interface due to the difference in intrinsic diffusivities of two diffusing species.…”
Section: Resultsmentioning
confidence: 99%
“…7(b) [10]. Remained solder phase was completely consumed because the atomic rearrangement to form the Cu 6 Sn 5 phase of the regular structure occurs at the Cu/solder interface [17]. Kirkendall void is formed along Cu 3 Sn/Cu interface due to the difference in intrinsic diffusivities of two diffusing species.…”
Section: Resultsmentioning
confidence: 99%
“…where, C 1 , C 2 , C ′ 1 , and C ′ 2 are integration constants related to the initial thickness of IMCs. Equations ( 16) and (17) show the polarity differences caused by the EM effect and can be used for the quantitative characterization of Cu 3 Sn and Cu 6 Sn 5 growth. 𝜌 𝜀 8.9 × 10 −8 Ω m [15] 𝜌 𝜂 17.5 × 10 −8 Ω m [15] 𝜌 Sn 11 × 10 −8 Ω m [15] Z * Cu∕𝜀 26.5 [15] Z * Cu∕𝜂 26.0 [15] Z * Cu∕Sn 2 [15] 2. , respectively.…”
Section: Modeling Of Cu 6 Sn 5 and Cu 3 Sn Thickness Growthmentioning
confidence: 99%
“…However, EM Cu flux in solder J Sn em , thermodiffusion Cu flux at Cu 6 Sn 5 /Sn interfaces J C chem , and Cu dissolution flux from Cu 6 Sn 5 layer to Sn solder J C diss will do not exist. In this phase, the thickness growth of Cu 3 Sn layers can also be predicted using Equations ( 15)- (17). After the Sn solder is completely consumed, no additional Sn exists to react with Cu atoms to form Cu 6 Sn 5 .…”
Section: Evolution Of Imcs After Sn Is Completely Consumedmentioning
confidence: 99%
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