Effects of temperature and strain rate on mechanical property of Sn96.5Ag3Cu0.5

The study of mechanical properties of Sn–Ag–Cu lead-free solders with different Ag contents and Ni doping under different strain rates and temperatures

“…So the mechanical properties from bulk solder test can be used in finite element modeling and simulation for the stress-strain behavior evaluation of microscale solder joint. It is known that solder mechanical properties vary significantly with temperature and strain rate [28][29][30]. In this paper, three different Ag contents including 1 wt.%, 2 wt.% and 3 wt.% Ag in Sn-xAg-0.5Cu solders, and two Ni additives including 0.02 wt.% and 0.05 wt.% Ni in Sn-1.0Ag-0.5Cu solder were investigated.…”

The adsorption of Ag3Sn nano-particles on Cu–Sn intermetallic compounds of Sn–3Ag–0.5Cu/Cu during soldering

“…Especially, plate-like Ag 3 Sn has been widely studied in recent investigations. The plate-like Ag 3 Sn could influence the growth and morphology of Cu 6 Sn 5 IMC and the stability of the solder joint [6][7][8]. Large Ag 3 Sn plates could adversely affect the plastic deformation properties of the solder [9] and caused plastic-strain localization at the boundary between the Ag 3 Sn plates and the bounding ␤-Sn phase [10].…”

Influence of indium addition on characteristics of Sn–0.3Ag–0.7Cu solder alloy

“…In general, adding an alloying element to the solder alloys is a mean to lower the melting temperature. However, the alloying element might have other effects on properties of the alloys, such as microstructure and mechanical properties [1][2][3][4][5][6][7][8].…”