Effects of the degradation of methane sulfonic acid electrolyte on the collapse failure of Sn–Ag alloy solders for flip-chip interconnections

Park, MiSeok; Nam, Do-Hwan; Jung, Kyung‐Hoon; Hong, Kyung-Sik; Kwon, Hyuk‐Sang

doi:10.1039/c7ra02193c

Cited by 11 publications

(2 citation statements)

References 35 publications

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“… 91 The dissolved oxygen in the solution seems to be the dominant factor leading to the oxidation of tin( ii ) of the electrolyte, with formation of SnO 2 particles. 92 Anti-oxidants are usually included in tin and tin alloy based baths to inhibit the formation of tin( iv ). 93 Examples of anti-oxidants include hydroquinone, hydrazine, ascorbic acid, and 2-hydroxy-6-methylbenzenesulfonic acid (cresol sulfonic acid).…”

Section: Electroplatingmentioning

confidence: 99%

Methanesulfonic acid (MSA) in clean processes and applications: a tutorial review

Binnemans,

Jones

2024

Green Chem.

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Section: Electroplatingmentioning

confidence: 99%

Methanesulfonic acid (MSA) in clean processes and applications: a tutorial review

Binnemans,

Jones

2024

Green Chem.

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“…35 A methane sulfonic acid–containing methanesulfonate salts of tin and silver in methane sulfonate acid has been reported. 36 The bath contained a silver complexing agent and an antioxidant. Proprietary baths with complex additives are commercially available for the electrodeposition of SnAg and SnAgCu alloys.…”

Section: Bump Fabrication Processesmentioning

confidence: 99%

Manufacturing processes for fabrication of flip-chip micro-bumps used in microelectronic packaging: An overview

Datta

2019

Journal of Micromanufacturing

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Electronic packaging is the methodology for connecting and interfacing the chip technology with a system and the physical world. The objective of packaging is to ensure that the devices and interconnections are packaged efficiently and reliably. Chip–package interconnection technologies currently used in the semiconductor industry include wire bonding, tape automated bonding and flip-chip solder bump connection. Among these interconnection techniques, the flip-chip bumping technology is commonly used in advanced electronic packages since this interconnection is an area array configuration so that the entire surface of the chip can be covered with bumps for the highest possible input/output (I/O) counts. The present article reviews the manufacturing processes for the fabrication of flip-chip bumps for chip–package interconnection. Various solder bumping technologies used in high-volume production include evaporation, solder paste screening and electroplating. Evaporation process produces highly reliable bumps, but it is extremely expensive and is limited to lead or lead-rich solders. Solder paste screening is cost-effective, but issues related to excessive void formation limits the process to low-end products. On the other hand, electrochemical fabrication of flip-chip bumps is an extremely selective and efficient process, which is extendible to finer pitch, larger wafers and a variety of solder compositions, including lead-free alloys. Electrochemically fabricated copper pillar bumps offer fine pitch capabilities with excellent electromigration performance. Due to these virtues, the copper pillar bumping technology is emerging as a lead-free bumping technology option for high-performance electronic packaging.

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Universal Intercalation/Alloying Hybrid Mechanism with ‐ICOHP Criterion in MAX Toward Steadily Ascending Lithium‐Ion Batteries

Guo,

Zhou,

Wang

et al. 2024

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Profiting from the unique atomic laminated structure, metallic conductivity, and superior mechanical properties, transition metal carbides and nitrides named MAX phases have shown great potential as anodes in lithium‐ion batteries. However, the complexity of MAX configurations poses a challenge. To accelerate such application, a minus integrated crystal orbital Hamilton populations descriptor is innovatively proposed to rapidly evaluate the lithium storage potential of various MAX, along with density functional theory computations. It confirms that surface A‐element atoms bound to lithium ions have odds of escaping from MAX. Interestingly, the activated A‐element atoms enhance the reversible uptake of lithium ions by MAX anodes through an efficient alloying reaction. As an experimental verification, the charge compensation and SnxLiy phase evolution of designed Zr2SnC MAX with optimized structure is visualized via in situ synchrotron radiation XRD and XAFS technique, which further clarifies the theoretically expected intercalation/alloying hybrid storage mechanism. Notably, Zr2SnC electrodes achieve remarkably 219.8% negative capacity attenuation over 3200 cycles at 1 A g−1. In principle, this work provides a reference for the design and development of advanced MAX electrodes, which is essential to explore diversified applications of the MAX family in specific energy fields.

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Effects of the degradation of methane sulfonic acid electrolyte on the collapse failure of Sn–Ag alloy solders for flip-chip interconnections

Cited by 11 publications

References 35 publications

Methanesulfonic acid (MSA) in clean processes and applications: a tutorial review

Methanesulfonic acid (MSA) in clean processes and applications: a tutorial review

Manufacturing processes for fabrication of flip-chip micro-bumps used in microelectronic packaging: An overview

Universal Intercalation/Alloying Hybrid Mechanism with ‐ICOHP Criterion in MAX Toward Steadily Ascending Lithium‐Ion Batteries

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