Effects of the Functional Groups of Nonconductive Films (NCFs) on Material Properties and Reliability of NCF Flip-Chip-On-Organic Boards

Chung, Chee Won; Kwon, Woocheol; Jang, Kyung-Woon; Park, Jinhyoung; Lee, Soon-Bok; Paik, Kyung‐Wook

doi:10.1109/tcapt.2007.898738

Cited by 11 publications

(3 citation statements)

References 7 publications

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“…TVs were designed to extract daisy chain resistance and single-bump conductivity data using four-point probe method, described by Paik et al [8]. Two TVs named TV1 and TV2 have been reported here with the details of die design shown in Table I.…”

Section: Tv Design and Fabricationmentioning

confidence: 99%

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Highly Reliable and Manufacturable Ultrafine Pitch Cu–Cu Interconnections for Chip-Last Embedding With Chip-First Benefits

Kumbhat

Choudhury

Mehrotra

et al. 2012

IEEE Trans. Compon., Packag. Manufact. Technol.

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Flip-chip packaging of Ultrafine pitch integrated circuits aggravates the stress-strain concerns as the interconnection pitch is decreased, requiring a fundamentally different system approach to interconnections, underfill processes and interfaces, and the substrate. This paper demonstrates an innovative and manufacturable solution to achieve excellent reliability at Ultrafine pitch (∼30 µm) using direct copper-copper (Cu-Cu) interconnections with adhesives. A number of 30-µm bump pitch test vehicles (TVs) were designed with 3 mm × 3 mm chips to extract both daisy chain resistance and singlebump resistance data. Assembled bump resistivity was found to be ∼3-4× lower than most solders. Performance of these TVs was studied for high temperature storage (HTS) life test, unbiased-highly accelerated stress test (U-HAST) and thermal cycling test (TCT). Test results showed that the assemblies with this next generation interconnection technology depicted excellent reliability results in HTS, U-HAST, and TCT tests. Based on these results, it is concluded that adhesive materials, provide unique opportunities for Ultrafine pitch and high performance interconnections.

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Section: Tv Design and Fabricationmentioning

confidence: 99%

“…As mentioned previously, one of the main reasons to design TV2 was to extract single-bump resistance based on four-point probe technique [8]. Single bump resistance values were measured for ∼20 bumps across different samples assembled with either nano-ACF or NCF.…”

Section: B Tv2mentioning

confidence: 99%

Highly Reliable and Manufacturable Ultrafine Pitch Cu–Cu Interconnections for Chip-Last Embedding With Chip-First Benefits

Kumbhat

Choudhury

Mehrotra

et al. 2012

IEEE Trans. Compon., Packag. Manufact. Technol.

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“…Therefore, a significant amount of shear deformation can happen between bumps and electrodes due to the CTE mismatch of Si and FR-4. [9], [10] Consequently, high Tg NCFs can enhance the thermal cycling reliability of NCFs FCOB assemblies, because high Tg NCFs FCOB assemblies have smaller stressfree state than low Tg NCFs FCOB assemblies during thermal cycling test with the temperature profile over NCFs' Tg. As shown in Fig.…”

Section: Effects Of Thermo-mechanical Properties Of Curedmentioning

confidence: 99%

Non-Conductive Films (NCFs) with Multi-Functional Epoxies and Silica Fillers for Reliable NCFs Flip Chip On Organic Boards (FCOB)

Chung

Paik

2007

2007 Proceedings 57th Electronic Components and Technology Conference

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Non-Conductive Films (NCFs) have become one of the promising interconnection adhesives for flip-chip assembly. Because NCFs have many advantages such as low cost, easy handling, and fine pitch application. However, effects of the material properties of NCFs on the reliability of NCFs flipchip assemblies have not been fully understood.In this paper, effects of multi-functional epoxy and the addition of silica fillers on thermo-mechanical properties of cured NCFs and thermal cycling reliability of NCFs flip-chipon-organic board (FCOB) assemblies were investigated. For the NCF materials, two kinds of thermosetting polymers, difunctional and multi-functional epoxies, and silica fillers of various contents (0 wt%, 10 wt%, and 20 wt%) were used. The curing behavior and thermo-mechanical properties of NCFs were measured for the NCF materials characterization. According to the results, NCFs using multi-functional epoxy had higher glass transition temperature (Tg), lower coefficient of thermal expansion (CTE), and higher storage modulus (E') in high temperature region than NCFs using di-functional epoxy. And, as the silica filler content increased, the CTE and storage modulus of cured NCFs deceased and increased respectively.Thermal cycling test (-40°C -150°C, 1000 cycles) was performed to investigate effects of thermo-mechanical properties of cured NCFs on thermal cycling reliability of NCFs FCOB assemblies. After 1000 cycles, Scanning Acoustic Microscopy (SAM) and Scanning Electron Microscopy (SEM) were used to detect delaminations and voids in test assemblies. According to the results, NCFs FCOB assemblies using NCFs with multi-functional epoxy had better thermal cycling reliability than those using NCFs with di-functional epoxy. And 10 wt% and 20 wt% silica added NCFs showed the best thermal cycling reliability in the electro-plated Au bump application and the stud Au bump application respectively. Consequently, thermo-mechanical properties of NCFs, especially Tg, should be improved and the amount of added silica fillers should be optimized for high thermal cycling reliability of NCFs FCOB assemblies.

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The reliability of ultrasonic bonded Cu to Cu electrode for 3D TSV stacking

Myung

Kim

et al. 2017

J Mater Sci: Mater Electron

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Effects of the Functional Groups of Nonconductive Films (NCFs) on Material Properties and Reliability of NCF Flip-Chip-On-Organic Boards

Cited by 11 publications

References 7 publications

Highly Reliable and Manufacturable Ultrafine Pitch Cu–Cu Interconnections for Chip-Last Embedding With Chip-First Benefits

Highly Reliable and Manufacturable Ultrafine Pitch Cu–Cu Interconnections for Chip-Last Embedding With Chip-First Benefits

Non-Conductive Films (NCFs) with Multi-Functional Epoxies and Silica Fillers for Reliable NCFs Flip Chip On Organic Boards (FCOB)

The reliability of ultrasonic bonded Cu to Cu electrode for 3D TSV stacking

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