Effects of the space environment on the calibration and performance of remote sensing instruments

Gabriel, S.B.; Spilling, David; Amieux, J.C.

doi:10.1016/s0273-1177(97)00244-5

Cited by 2 publications

(1 citation statement)

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“…[6][7][8] These intelligent integrated electrical systems are the essential composition parts in spacecrafts, and their reliability is the key factor to the high cost of their fabrication, launching, operation and maintenance. [9][10][11] The electrical systems work in the low earth orbit (LEO) environments and suffer from ultraviolet (UV) radiation, thermal cycles or/and atomic oxygen attack, [12][13][14] which may lead to the destruction of seals, fracture of pins and breakage of inner bonding sites and finally cause failures of the devices even the whole system. 9,15 Although the intensity of UV radiation in the LEO environment is quite weak, the single UV photoelectron's energy is strong enough to destroy the chemical structure in multilayer films of components, and lose devices' photoelectric properties designed originally.…”

Section: Introductionmentioning

confidence: 99%

Electron migration behavior of Au/Cu multilayer films on Si substrates under UV radiation

Kai

Yao

Cao

et al. 2015

Phys. Chem. Chem. Phys.

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Au/Cu multilayer films were plated by the magnetron sputtering method on p-Si(100) substrates. The sample temperature was changed from room temperature to 44 °C under UV radiation in a vacuum within 120 minutes, and then remained stable with treatment time increased. Meanwhile, the surface roughness was changed from 4.2 nm to 5.9 nm and then also remained stable. But the interface width of Au/Cu still continued to increase during that steady stage. The calculation results show that the concentration gradient of Cu atoms fell to 2.24 in 360 minutes from 3.45 at the beginning. The increase of defects in the grain boundaries of the Au layer was induced by UV radiation, because the Cu element had a smaller work function relative to the Au element and it was more likely to migrate to the surface layer through the grain boundaries of the Au layer.

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