“…A more recent trend in the hybrid AM field is the application of peening processes during the intermediate build phases. Surface modification processes such as peening [for example, shot peening (SP), hammer peening (HP), laser shock peening (LSP)] have been applied as a post processing step for AM components (Hönnige et al , 2017; Hackel et al , 2018; Maamoun et al , 2018; Walker et al , 2019; Xing et al , 2019; Gatto et al , 2020; Jin et al , 2020; Soyama and Takeo, 2020; Lesyk et al , 2021; Walczak and Szala, 2021; Aguado-Montero et al , 2022). More recently, they have been hybridized with AM processes such that they are applied to intermediate build layers (Gale and Achuhan, 2017; Kalentics et al , 2017a, 2017b, 2018, 2019, 2020; Sealy et al , 2021; Zhang et al , 2021b).…”