Effects of underfill thickness on mechanical properties and fracture behavior of Si/underfill/Si adhesion structures

Sun, Lei; Zhou, Min-Bo; Sun, Tao Lin; Zhang, Xin-Ping

doi:10.1109/icept50128.2020.9202876

Cited by 4 publications

(1 citation statement)

References 9 publications

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“…Moreover, the curing stage was studied numerically to predict the package warpage (Lin and Lee, 2020). In the post-underfill stage, the reliability of underfilled package was evaluated in terms of its structural mechanical behaviours (Sun et al, 2020;Yang et al, 2020;Che et al, 2020) and thermal aspects (Pham et al, 2020).…”

Section: Introductionmentioning

confidence: 99%

Surface energetic-based analytical filling time model for flip-chip underfill process

Abas

2021

SSMT

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Purpose This paper aims to present new analytical model for the filling times prediction in flip-chip underfill encapsulation process that is based on the surface energetic for post-bump flow. Design/methodology/approach The current model was formulated based on the modified regional segregation approach that consists of bump and post-bump regions. Both the expansion flow and the subsequent bumpless flow as integrated in the post-bump region were modelled considering the surface energy–work balance. Findings Upon validated with the past underfill experiment, the current model has the lowest root mean square deviation of 4.94 s and maximum individual deviation of 26.07%, upon compared to the six other past analytical models. Additionally, the current analytically predicted flow isolines at post-bump region are in line with the experimental observation. Furthermore, the current analytical filling times in post-bump region are in better consensus with the experimental times as compared to the previous model. Therefore, this model is regarded as an improvised version of the past filling time models. Practical implications The proposed analytical model enables the filling time determination for flip-chip underfill process at higher accuracy, while providing more precise and realistic post-bump flow visualization. This model could benefit the future underfill process enhancement and package design optimization works, to resolve the productivity issue of prolonged filling process. Originality/value The analytical underfill studies are scarce, with only seven independent analytical filling time models being developed to date. In particular, the expansion flow of detachment jump was being considered in only two previous works. Nonetheless, to the best of the authors’ knowledge, there is no analytical model that considered the surface energies during the underfill flow or based on its energy–work balance. Instead, the previous modelling on post-bump flow was based on either kinematic or geometrical that is coupled with major assumptions.

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