Thirty millimeters of each wire, as received from manufacturer, were used by means of SEM/EDS with Spectrometer TN-M3055 (Noran, Middleton, WI, USA) coupled to SEM JSM 5410 (Jeol, Tokyo, Japan). Five 30mm-long segments of each wire were set in a sample holder deprived of Ni, Ti and Cu. Analysis was carried out in ten points of each wire segment randomly chosen and previously cleaned with Acetone PA in an ultrasonic bath.
X-Ray Diffraction (XRD)Wires, as received from manufacturer, were cut in ten 15mm-long pieces and placed side by side over an adhesive tape. These samples were submitted to X-ray diffraction (XRD) with PW-1710 (Philips PANalytical, Almelo, The Netherlands) under room temperature conditions. Three sets of ten 15mm-long wire segments were tested and analyzed at room temperature with Cu-Kα radiation. Diffraction peaks were indexed according to APD software (Philips-PANalytical, Almelo, The Netherlands) and electronic charts from ICDD (International Committee for Diffraction Data).