Effects of voids on thermal-mechanical reliability of lead-free solder joints

Abstract

Abstract. Reliability of electronic packages has become a major issue, particularly in systems used in electrical or hybrid cars where severe operating conditions must be met. Many studies have shown that solder interconnects are critical elements since many failure mechanisms originate from their typical response under thermal cycles. In this study, effects of voids in solder interconnects on the electronic assembly lifetime are estimated based on finite element simulations.

An Experimental Investigation of a Flexible Sintered Silver Joint for Micro-Joining Based on a Design of Experiments

“…With the development of power electronics systems, there is an increasing need of having interconnection materials with properties that can ensure both a good mechanical strength of the bonding and high thermal/electrical conductivities in the assembly. So far, the lead-free solders have been considered as an attractive solution for die attach [1][2][3] but sintered joints based on nano-silver paste [4][5][6] are now considered as a replacement solution in the most demanding applications. The sintering technique proves indeed to be a promising solution, offering a thermal conductivity increased by many folds for the electronic packaging [7].…”