2011
DOI: 10.1016/j.icheatmasstransfer.2011.03.032
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Effects of wall slip and temperature jump on heat and mass transfer characteristics of an evaporating thin film

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Cited by 20 publications
(15 citation statements)
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“…They also concluded that the substrate thickness does have a minor effect on the total heat transfer. Kou and Bai (2011) related wall slip to a temperature jump at the solid-liquid interface. They concluded that the presence of a temperature jump at the interface can reduce heat and mass transport characteristics.…”
Section: Varying Thermophysical Properties Slip Boundary Conditionmentioning
confidence: 99%
“…They also concluded that the substrate thickness does have a minor effect on the total heat transfer. Kou and Bai (2011) related wall slip to a temperature jump at the solid-liquid interface. They concluded that the presence of a temperature jump at the interface can reduce heat and mass transport characteristics.…”
Section: Varying Thermophysical Properties Slip Boundary Conditionmentioning
confidence: 99%
“…As the thin-film increases in thickness, the disjoining pressure effects decrease in strength as a reciprocal of the film thickness and allow for the film to undergo evaporation. With the presence of evaporation in the thin-film region, some works suggest the potential for local evaporative cooling [3,[24][25][26], while other models are unable to capture this phenomena [14,23,[27][28][29]. Any local changes in temperature may result in changes to the substrate temperature profile, an aspect typically treated as a constant wall temperature in many models [9,12,13,23,29].…”
Section: Evaporating Thin-film Regionmentioning
confidence: 99%
“…The Runge-Kutta method of solving the governing ODEs has been used extensively with good results [10,26,[41][42][43].…”
Section: Continuum Modelsmentioning
confidence: 99%
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