2017
DOI: 10.1103/physrevapplied.7.064007
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Effects of Wavelength and Defect Density on the Efficiency of (In,Ga)N-Based Light-Emitting Diodes

Abstract: We measured the electro-luminescence of light emitting diodes (LEDs) on substrates with low dislocation densities (LDD) at 10 6 cm −2 and low 10 8 cm −2 , and compared them to LEDs on substrates with high dislocation densities (HDD) closer to 10 10 cm −2. The external quantum efficiencies (EQEs) were fitted using the ABC-model with and without localisation. The non-radiative recombination (NR) coefficient A was constant for HDD LEDs, indicating that the NR was dominated by dislocations at all wavelengths. Howe… Show more

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Cited by 20 publications
(26 citation statements)
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“…2(a), instead reporting large scatter across samples. 2,3 Following Ref. 16, we hypothesize that the values of A in some of those reports may in fact characterize carrier escape from the QW 17 and transport-related recombinations in defective heteroepitaxial LEDs, 6-8 rather than intrinsic NRR in the QW.…”
mentioning
confidence: 90%
“…2(a), instead reporting large scatter across samples. 2,3 Following Ref. 16, we hypothesize that the values of A in some of those reports may in fact characterize carrier escape from the QW 17 and transport-related recombinations in defective heteroepitaxial LEDs, 6-8 rather than intrinsic NRR in the QW.…”
mentioning
confidence: 90%
“…The emission of LEDs is commonly described by the ABC model. [1][2][3][4][5][6][7][8] In the ABC model, the carrier density n determines the probability of carriers encountering each other and thus the different recombination rates. Shockley-Read-Hall (SRH) nonradiative recombination is assumed as An (carriers meet a defect subsequently), the radiative recombination is Bn 2 (meeting of an electron with a hole), and the nonradiative Auger effect loss is Cn 3 (three carriers must meet).…”
Section: Fitting Of the Peak Iqementioning
confidence: 99%
“…Well-established growth processes with respect to growth temperature were employed. [43][44][45][46][47] Aer covering the LED layers with photoresist, holes were dened using electron-beam lithography and subsequent development. Aer the physical vapour deposition of Ni followed by a li-off process, Ni caps were formed, which served as the mask for the subsequent Ar-ion beam etching process.…”
Section: Materials and Sample Preparationmentioning
confidence: 99%