“…Electroless deposition, compared with electrodeposition, is preferred in many industrial fields because it can produce homogeneous coatings on various substrates with a complicated shape [1][2][3][4][5]. Among of the various electroless deposition coatings such as Ni [6], Au [7], Ag [8,9], Cu [10], Cu-Sn [11], Cu-P [12] and Ni-B [13,14], electroless Ni-P coating (ENPC) and the modified one by introducing the third element or other reinforcement particles have gained broad applications because the ENPCs have many advantages such as an excellent anti-corrosive property, high hardness and good wear resistance after being annealed, high electrical and thermal conductivity, good solderability and low cost of preparing ENPCs [15][16][17][18]. However, because metal nickel in the ENPC can be oxidised in the air, the surface of the ENPC is easily covered by a thin oxide film.…”