Efficient Heat Transfer Approximation for the Chip-on-Substrate Problem

Fisher, Timothy S.; Zell, F. A.; Sikka, Kamal; Torrance, K. E.

doi:10.1115/1.2792163

Cited by 19 publications

(6 citation statements)

References 14 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…The chip temperature is the average of cell temperatures in the chip area. Refinement of the cell size to 1 mm changed the chip temperature only by 0.4 K. In the present case, the corrections on by the configuration factor ((4)) are within the variations shown in Table I, hence, they are ignored setting 0 in (8). To use (7) we define the distance between the chips using the side length of the heat source chip as a unit.…”

Section: Fast Estimates Of the Effetcs Of Heat Spreading On Chip mentioning

confidence: 86%

“…Using ((4)) and ( (7)) the temperature of a heat source at on a substrate can be estimated from (8) where is the number of heat sources other than and are the temperatures of the heat source at and the th heat source (at on a square substrate, respectively, is the configuration factor for the th heat source, and is the correlation factor for the heat source locations and . 1) An Example Problem: A substrate has three chips, one of type A and two of type B (Fig.…”

Section: Fast Estimates Of the Effetcs Of Heat Spreading On Chip mentioning

confidence: 99%

“…4. The temperatures of the chips located at the center of the square substrate are estimated using the two-dimensional (2-D) heat conduction numerical solver and the fast estimate formulas reported by Fisher et al [8] and Lee [9]. The values of are shown in Table I.…”

Section: Fast Estimates Of the Effetcs Of Heat Spreading On Chip mentioning

confidence: 99%

See 2 more Smart Citations

Thermal issues in microsystems packaging

Nakayama¹

2000

IEEE Trans. Adv. Packag.

View full text Add to dashboard Cite

Miniaturization of electronic/mechanical systems is achieved by packing different functional components into tight space. The heat transfer analysis for such systems has to deal with geometrically complex heat transfer paths, and it needs to be done quickly in response to every design alteration. This paper proposes a concept that aims at reduction of analysis load on the packaging designer. The proposed scheme is composed of two major steps. First, a computer program "configuration generator" is used to generate possible geometric configurations of heat transfer paths in a systematic manner. Second, temperature solutions for these configurations are compressed into "fast estimate" formulas that free the packaging designer from the need to perform involved heat transfer analysis. This approach is illustrated using a topic of heat spreading on the planar substrate as an example.Miniaturization of systems also raises another issue for the thermal design; that is the coupling between the system configuration and the overall heat dissipation to the environment. A model situation is considered where heat diffuses from a zone on the system shell and to the environment by natural convection and radiation. In the parametric domain spanned by the thermal conductivity of shell material and the system's characteristic length there is a zone where the system-level heat transfer is sensitive to the system's configuration. Such characteristic length is around 1 cm for systems encapsulated in plastics, 3-10 cm for those in ceramic and alloy shells, and 10-40 cm in copper or aluminum clad systems.Index Terms-Fast solution, geometric complexity, geometry and heat transfer, heat spreader, microsystems.

show abstract

Section: Fast Estimates Of the Effetcs Of Heat Spreading On Chip mentioning

confidence: 86%

Section: Fast Estimates Of the Effetcs Of Heat Spreading On Chip mentioning

confidence: 99%

See 1 more Smart Citation

Thermal issues in microsystems packaging

Nakayama¹

2000

IEEE Trans. Adv. Packag.

View full text Add to dashboard Cite

show abstract

“…Appropriately, the magnitude of this temperature difference is modeled via a thermal spreading (or constriction) resistance [8][9][10][11][12][13][14][15][16][17][18][19][20], Unlike the thermal resistance due to conduction (e,g,, material thermal resistance), the thermal spreading resistance is not intrinsic to the heat spreader but depends on the heat source-to-spreader area-mismatch, the thickness and thermal conductivity of the heat spreader and the total convection (and/or radiation) heat transfer coefficient related to the surroundings [8][9][10][11][12][13][14][15][16][17][18][19][20], The "thermal spreading design problem" consists of quantifying and minimizing the thermal spreading resistance within a heat spreader.…”

Section: Introductionmentioning

confidence: 99%

Thermal Spreading Analysis of Rectangular Heat Spreader

Thompson

2014

Journal of Heat Transfer

View full text Add to dashboard Cite

A unique nondimensional scheme that employs a source-to-substrate "area ratio" (e.g., footprint), has been utilized for analytically determining the steady-state temperature field within a centrally-heated, cuboidal heat spreader with square crosssection. A modified Laplace equation was solved using a Fourier expansion method providing for an infinite cosine series solution. This solution can be used to analyze the effects of Biot number, heat spreader thickness, and area ratio on the heat spreader's nondimensional maximum temperature and nondimensional thermal spreading resistance. The solution is accurate only for low Biot numbers (Bi <0.00J); representative of highly-conductive, tn'o-phase heat spreaders. Based on the solution, a unique method for estimating the effective thermal conductivity of a two-phase heat spreader is also presented. [DOI; 10,1115/1,4026558]

show abstract

“…where M is the number of heat sources other than P, Bo and Bonl are the temperatures of the heat source at P and the m-th heat "til source (at P , ) on a square substrate, respectively, fm is the configuration factor for the m-th heat source, and&,p is the correlation factor for the heat source locations P , and P. The temperature rises on the square spreader can be estimated using the correlations reported in [8] and [9]. More details are reported in [IO].…”

Section: (3)mentioning

confidence: 99%

A novel approach to the design of complex heat transfer systems: heat spreader and portable computer design-case studies

Nakayama

Behnia²,

Soodphakdee³

ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH3

View full text Add to dashboard Cite

The paper describes a novel approach to solving heat transfer problems in geometrically complex systems. In the present approach, instead of simulating the detailed complex geometry, templates of components and devices are assumed rather than working on actual components. By valying the template dimensions a systematic study on the effects of geometrical Configurations on cooling airflow and heat transfer is made possible. The application of the approach is illustrated drawing examples from cases of heat spreader designs and heat transfer analysis of portable computers. The purpose of the study is to develop a methodology whereby the packaging designer is freed from the task of performing detailed numerical analysis. Currently available numerical analysis tools such as computational fluid dynamics (CFD) codes are given a role in an undertaking to create databases from which fast deslgn formulas are developed.KEY WORDS: heat transfer in complex systems, portable computers, heat spreader, CFD simulations 1. INTRODUCTION As electronic systems are diversifying in their function, information processing performance, hardware morphology, and the relevant thermal issues of importance are also diversifying. Cooling of chips, which has been the central issue for thermal management of large systems in the 1910's to 198O's, is now one of the issues that need attention of the packaging designer. Other issues are arising from the system's shrinking physical size and the diversifying usage environment. For example, in portable equipment, different components are crammed in a tight space and they have different thermal criteria for reliable operation. So, in the design of portable equipment, heat flow paths need to be managed to create a desirable temperature distribution in the system box. Similar situations are found in microsystems where electronic circuits and MEMS devices are accommodated in a tight space. Also, the temperature of the system's interface to the human skin needs to be controlled in portable and wearable equipment.

show abstract

Efficient Heat Transfer Approximation for the Chip-on-Substrate Problem

Cited by 19 publications

References 14 publications

Thermal issues in microsystems packaging

Thermal issues in microsystems packaging

Thermal Spreading Analysis of Rectangular Heat Spreader

A novel approach to the design of complex heat transfer systems: heat spreader and portable computer design-case studies

Contact Info

Product

Resources

About