A printed circuit board via is analyzed as a collection of sections bounded by grounded planes. A semianalytical expression for the capacitance of such a section is deduced and numerically adapted to solutions obtained with the finite‐element method. For high permittivities, one may also estimate the capacitance of a via terminating at a dielectric interface. ©1999 John Wiley & Sons, Inc. Microwave Opt Technol Lett 20: 160–163, 1999.