Efficient preparation of PDMS-based conductive composites using self-designed automatic equipment and an application example

Abstract

<jats:title>Abstract</jats:title> <jats:p>In this paper, the fabrication process of polydimethylsiloxane (PDMS)-based microstructured conductive composites via differential temperature hot embossing was proposed based on the spatial confining forced network assembly theory. The mold temperature was kept constant throughout the whole embossing cycle in this method, whereas the setting temperatures of the upper and lower molds were different. To solve the problem of poor conveying performance, a double-station automatic hot embossing equipment was designed and developed. A “bullet-filled” accurate feeding system was designed aiming at the high viscosity and feeding difficulty of blended PDMS-based composites before curing. Dispersion mold and semifixed compression mold were designed according to different functional requirements of different workstations. The developed automatic hot embossing equipment had already been successfully applied to the continuous preparation of conductive composites with greatly improved processing precision and efficiency. Furthermore, the conductive composites with and without microstructures can be used as flexible sensors for pressure measurements.</jats:p>

Development and Application of Hot Embossing in Polymer Processing: A Review

“…Fig. 11d presented the sample image and schematic diagram of a polymeric flexible piezoresistive sensor that was prepared via the hot 67,187,188 embossing technique.…”

The Contribution of Conductive Network Conversion in Thermal Conductivity Enhancement of Polymer Composite: A Theoretical and Experimental Study

“…), ceramic fillers (including Al2O3, [23] AlN, [24] SiC, [25] BN and BN nanotube, [26,27] etc. ), and carbon series fillers (including graphene, [28] graphene oxide, [29] carbon nanotubes, [30,31] graphite, [32] carbon fibers, [33,34] etc.). Previous researches have already paid a lot of attention on the influences of size, shape, filling content, and surface modification of single or hybrid thermal conductive fillers on TCs of polymer composites.…”