This paper addresses reconjgurations and cooling of mesh array in 3 0 stacked integration by considering thermo-radiation.We propose heuristic replacement policy to avoid defects on a wafer by moving hot processing elements (PES) toward edge of a wafer to cool eflciently. Introducing a thermoradiation model in 3 0 stacked integration, reconfiguration performance arid thermo-radiation of 3 0 stacked mesh array are evaluated.Three cooling schemes are proposed and evaluated. Placement of spare PES, moving direction of hot PES and heuristic replacenlent are discussed from viewpoint of system yield and cooling performance. The heuristic replacement policy gathers a various replacement by repeating recotlfiguration procedure, and estimates cooling eficiency based on thermo-radiation model for each gathered replacement, then the policy adopts the best replacement.Comparing system yields and marimiini temperatures by thermo-radiation simulations on Cray-T3E super computer, these cooling approaches maintain the 3 0 stacked mesh array to be lower temperature keeping high system yield.