Efficiently enhancing the tracking and erosion resistance of silicone rubber by the synergism of fluorine-containing polyphenylsilsesquioxane and ureido-containing MQ silicone resin

Wu, Tongyi; Lai, Xuejun; Liu, Fengjiao; Li, Hongqiang; Zeng, Xingrong

doi:10.1016/j.apsusc.2018.08.021

Cited by 26 publications

(5 citation statements)

References 31 publications

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“…Silicone resin has great adjustability that could easily enhance or change its properties by adjusting organic groups. Usually, a phenyl group could be used to improve the thermal stability [7], fluorine [8] and ureido radical [9] could be used to enhance the tracking resistance, and noble metal [10][11][12] could also be used to increase the photoelectric and magnetic effect. Due to this, silicone resin has been widely studied as low-k [13,14] and high-k [15,16] material in recent years.…”

Section: Introductionmentioning

confidence: 99%

High Thermal Stability and Low Dielectric Constant of BCB Modified Silicone Resins

Wei

et al. 2023

Polymers

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Based on the excellent physical properties and flexible molecular modifiability, modified silicone resins have received favorable attention in the field of microelectronics, and recently a number of modified silicone resins have appeared while few breakthroughs have been made in low dielectric constant (low-k) materials field due to the limitations of structure or the curing process. In this work, functional silicone resin with different BCB contents was prepared with two monomers. The resins showed low dielectric constant (k = 2.77 at 10 MHz) and thermal stability (T5% = 495.0 °C) after curing. Significant performance changes were observed with the increase in BCB structural units, and the functional silicone obtained does not require melting and dissolution during processing because of good fluidity at room temperature. Moreover, the mechanical properties of silicone resins can be also controlled by adjusting the BCB content. The obtained silicone resins could be potentially used in the field of electronic packaging materials.

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Section: Introductionmentioning

confidence: 99%

High Thermal Stability and Low Dielectric Constant of BCB Modified Silicone Resins

Wei

et al. 2023

Polymers

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“…Addition-cure liquid silicone rubber (ALSR) is a packaging material that has been widely application in electronics, electrical power, and electrical elds [1][2][3][4][5] because of its excellent high-and low-temperature resistance, good elastic properties, and lack of by-product residues or volatiles. However, practical application of pure ALSR is severely hindered by its poor mechanical properties [6,7] and poor erosion resistance [8][9][10][11][12][13][14]. Packaging material failure due to corrosion often causes great harm to electronic components, which signi cantly threatens the security of electrical systems.…”

Section: Introductionmentioning

confidence: 99%

Efficiently Enhancing Low-dielectric Properties and Chemical Resistances of Addition-cure Liquid Silicone Rubber by Filling With Silicone-modified Eucommia Gum Nanofiller

Sheng-pei

Wang

et al. 2021

Preprint

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It is of great interest and remains a challenge to simultaneously improve the low-dielectric properties and chemical resistances of addition-cure liquid silicone rubber (ALSR). In this work, we proposed an efficient approach to address this issue by filling silicone-modified eucommia gum nanofiller (SEUG) into ALSR. By adding 5 wt% SEUG, the dielectric constant of the SEUG/ALSR composite rubber was significantly lower than that of neat ALSR both at 102 Hz, 103 Hz and 104 Hz. Simultaneously, the SEUG/ALSR composite rubber exhibited better mechanical and insulation properties than the neat ALSR after HCl, NaCl, and oil resistance tests. Our findings demonstrated the great potential for fabricating silicone rubber with low-dielectric properties and erosion resistance by the utilization natural biomass rubber material, endowing it with excellent mechanical performance and degradability.

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Section: Introductionmentioning

confidence: 99%

Effects of eucommia gum filler on the dielectric properties and chemical resistances of addition-cure liquid silicone rubber

Wang

et al. 2021

J Mater Sci: Mater Electron

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It is of great interest and remains a challenge to simultaneously improve the low-dielectric properties and chemical resistances of addition-cure liquid silicone rubber (ALSR). In this work, we proposed an e cient approach to address this issue by lling silicone-modi ed eucommia gum nano ller (SEUG) into ALSR.By adding 5 wt% SEUG, the dielectric constant of the SEUG/ALSR composite rubber was signi cantly lower than that of neat ALSR both at 10 2 Hz, 10 3 Hz and 10 4 Hz. Simultaneously, the SEUG/ALSR composite rubber exhibited better mechanical and insulation properties than the neat ALSR after HCl, NaCl, and oil resistance tests. Our ndings demonstrated the great potential for fabricating silicone rubber with low-dielectric properties and erosion resistance by the utilization natural biomass rubber material, endowing it with excellent mechanical performance and degradability.

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Efficiently enhancing the tracking and erosion resistance of silicone rubber by the synergism of fluorine-containing polyphenylsilsesquioxane and ureido-containing MQ silicone resin

Cited by 26 publications

References 31 publications

High Thermal Stability and Low Dielectric Constant of BCB Modified Silicone Resins

High Thermal Stability and Low Dielectric Constant of BCB Modified Silicone Resins

Efficiently Enhancing Low-dielectric Properties and Chemical Resistances of Addition-cure Liquid Silicone Rubber by Filling With Silicone-modified Eucommia Gum Nanofiller

Effects of eucommia gum filler on the dielectric properties and chemical resistances of addition-cure liquid silicone rubber

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