2024
DOI: 10.1002/app.55500
|View full text |Cite
|
Sign up to set email alerts
|

Elastomeric thermal interface materials with high through‐plane thermal conductivity by 3D printing

Yong Fan,
Yongbin Wang,
Jun Qiu

Abstract: Creating directional heat pathways within polymer‐based elastomeric thermal interface materials (TIMs) using oriented thermally conductive fillers is an effective strategy for developing highly thermally conductive materials. In this work, we report the fabrication of oriented carbon fibers/alumina/silicone gel composites through a three‐dimensional printing method. Because of the high orientation degree of carbon fiber (CF) in the vertical direction, the resulting material demonstrates a through‐plane thermal… Show more

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...

Citation Types

0
0
0

Year Published

2024
2024
2024
2024

Publication Types

Select...
4

Relationship

0
4

Authors

Journals

citations
Cited by 4 publications
references
References 40 publications
0
0
0
Order By: Relevance