Elastomeric Thermal Interface Materials with High Through‐Plane Thermal Conductivity from Carbon Fiber Fillers Vertically Aligned by Electrostatic Flocking

Uetani, Koji; Ata, Seisuke; Tomonoh, Shigeki; Yamada, Takeo; Yumura, Motoo; Hata, Kenji

doi:10.1002/adma.201401736

Cited by 259 publications

(156 citation statements)

References 22 publications

Supporting

Mentioning

151

Contrasting

Order By: Relevance

“…Scaling of device dimensions has enabled performance enhancement but as a trade-off scaled devices experience higher leakage current induced excessive power consumption in their idle state. [1][2][3][4][5][6][7] This also results into higher heat dissipation and eventually lower battery lifetime. With increased demand for ultra-mobile electronics, this rapid power draining acts as one of the main show stoppers.…”

Section: Introductionmentioning

confidence: 99%

Enhanced cooling in mono-crystalline ultra-thin silicon by embedded micro-air channels

et al. 2015

View full text Add to dashboard Cite

In today’s digital world, complementary metal oxide semiconductor (CMOS) technology enabled scaling of bulk mono-crystalline silicon (100) based electronics has resulted in their higher performance but with increased dynamic and off-state power consumption. Such trade-off has caused excessive heat generation which eventually drains the charge of battery in portable devices. The traditional solution utilizing off-chip fans and heat sinks used for heat management make the whole system bulky and less mobile. Here we show, an enhanced cooling phenomenon in ultra-thin (>10 μm) mono-crystalline (100) silicon (detached from bulk substrate) by utilizing deterministic pattern of porous network of vertical “through silicon” micro-air channels that offer remarkable heat and weight management for ultra-mobile electronics, in a cost effective way with 20× reduction in substrate weight and a 12% lower maximum temperature at sustained loads. We also show the effectiveness of this event in functional MOS field effect transistors (MOSFETs) with high-κ/metal gate stacks.

show abstract

Section: Introductionmentioning

confidence: 99%

Enhanced cooling in mono-crystalline ultra-thin silicon by embedded micro-air channels

et al. 2015

View full text Add to dashboard Cite

show abstract

“…2b-f). The thermal conductivity in the orientation direction has a critical dependence on the orientation of fillers [11], and the strong alignment of BN determines the outstanding heat dissipation capability in the orientation direction. Figure 4 shows the thermal conductivity of POE/BN composites parallel and perpendicular to the BN flake aligning direction as a function of BN content.…”

Section: Resultsmentioning

confidence: 99%

“…Carbon-based materials and metallic fillers such as graphite [5], graphite/graphene nanoplateles (GNPs) [6,7], graphene [8], carbon nanotubes (CNTs) [9], carbon fiber [10,11], silver particles, silver nanowires [12], and copper nanowires [2,13] have been widely utilized to fabricate polymer-based TIMs owing to their extraordinary inherent thermal conductivity [14,15]. However, the incorporation of electrically conductive fillers will inevitably cause the great deterioration of electrical insulation performance, which hinders the wide use of these TIMs in next-generation microelectronics devices [16,17] such as LED devices with chips directly placing on the heat sink, single chip packages [18], and high-voltage devices.…”

Section: Introductionmentioning

confidence: 99%

Electrically insulating POE/BN elastomeric composites with high through-plane thermal conductivity fabricated by two-roll milling and hot compression

Feng

Bai

Bao

et al. 2017

Adv Compos Hybrid Mater

View full text Add to dashboard Cite

In this work, we reported a kind of electrical insulating, highly through-plane thermally conductive polyolefin elastomer (POE)-based composites filled with commercial boron nitride (BN) fabricated by a conventional melt-mixing method of two-roll milling, followed by hot compression and mechanical cutting. The as-fabricated composites with BN flakes perfectly aligning vertically in the matrix revealed high through-plane thermal conductivity (6.94 W m −1 K −1 at a BN content of 43.75 vol%), outstanding electrical insulation (4.34× Ω cm at a BN content of 43.75 vol%), and quite good mechanical properties. This fabrication procedure features facile process, industrial equipment, and easy industrialization, and the as-prepared composites with outstanding comprehensive performance are promising for thermal interface materials (TIMs) application.

show abstract

“…The influence factors for thermal conductivity of TFCs are mainly from the following several aspects: filler shape, functional treatment technique, volume fraction, type of base fluid, directional alignment technique, interfacial thermal resistance [25][26][27], and so forth. Among them, the filler shape is one of the most important but easily overlooked factors.…”

Section: Introductionmentioning

confidence: 99%

Effect of Filler Shape on the Thermal Conductivity of Thermal Functional Composites

Liu

Chen

Zhou

et al. 2017

Journal of Nanomaterials

View full text Add to dashboard Cite

With the rapid development of electronic industry, heat dissipation issue becomes more and more important. Thermal functional composites (TFCs) are usually binary composites, filled with thermal conductive additives (nanomaterials) in matrix, and the composites show good thermal performance. The theoretical and experimental results show that the filler shape is one of the most important but easily overlooked factors. In this article, we provide a systematic review of the effect of the filler shape on the thermal conductivity of TFCs, and the heat transfer enhancement based on synergistic effect is also summed up. Finally, the future trends of further improving thermal properties of TFCs are predicted.

show abstract

Elastomeric Thermal Interface Materials with High Through‐Plane Thermal Conductivity from Carbon Fiber Fillers Vertically Aligned by Electrostatic Flocking

Cited by 259 publications

References 22 publications

Enhanced cooling in mono-crystalline ultra-thin silicon by embedded micro-air channels

Enhanced cooling in mono-crystalline ultra-thin silicon by embedded micro-air channels

Electrically insulating POE/BN elastomeric composites with high through-plane thermal conductivity fabricated by two-roll milling and hot compression

Effect of Filler Shape on the Thermal Conductivity of Thermal Functional Composites

Contact Info

Product

Resources

About