waveguides, light couplers, lasing media, photonic crystals, spectral filters, reflectors, and sensing devices [1] as well as printed electronic devices like thin-film transistors (TFTs), organic inverters, ring oscillators, logic gates, organic photovoltaics (OPVs), organic light emitting diodes (OLEDs) for displays, OLED lighting, electronics components, and integrated smart systems. [1-5] Unfortunately, the application of argument (1) "infinite chemical tailorability" makes argument (2) "low-cost solution coating" much more challenging because each new material has to be reoptimized for coating or re-synthesized for photo cross-linking and many materials are just difficult or impossible to reproducibly synthesize and process. The optoelectronic material properties of OSC materials are sufficient for industrial products, but there is no universally applicable approach or method for depositing, patterning, and doping OSC materials that serves the equivalent functions that photolithography does for silicon technology. For Si, a simple photolithography processing step defines a pattern on the substrate with diffraction limited resolution. We note that multi-step photolithography, e-beam, and other processes can produce significantly smaller features. Regardless of the photomask resolution, the mask enables selective area implantation of dopants into the Si, deposition of another material onto the Si, or etching the Si. Photolithography enables non-contact selective area patterning, etching, and doping with diffraction limited lateral resolution in Si. After Si processing, the lithographic mask is etched away without damaging the Si. Except in very limited cases, photolithography is not compatible with OSC processing because OSCs are damaged by removal of the mask and the other chemical processing steps. There is no fast and easy photopatterning method for OSCs that serves the same functions that photolithography serves for Si technology. The absence of an equivalent photoprocessing method with sub-micron resolution for OSC materials greatly limits the use of OSC materials in devices. We present here a photoprocessing method that enables non-contact selected area patterning, etching, and doping of the organic semiconductor poly-3-hexylthiophene (P3HT) with diffraction limited lateral resolution. Diffraction limited resolution with a 405 nm laser yields well-defined lateral features as small as 300 nm. [6] Compared to solution-coating methods, for Recent development of dopant induced solubility control (DISC) patterning of polymer semiconductors has enabled direct-write optical patterning of poly-3-hexylthiophene (P3HT) with diffraction limited resolution. Here, the optical DISC patterning technique to the most simple circuit element, a wire, is applied. Optical patterning of P3HT and P3HT doped with the molecular dopant 2,3,5,6-tetrafluoro-7,7,8,8-tetracyanoquinodimethane (F4TCNQ) wires with dimensions of 20-70 nm thickness, 200-900 nm width, and 40 μm length is demonstrated. In addition, optical patterning of wire...