2020
DOI: 10.1088/1361-6641/ab924e
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Electrical and microscopic characterization of p+-type layers formed in HgCdTe by arsenic implantation

Abstract: The Hall-effect (with mobility spectrum analysis) and capacitance measurements were combined with transmission electron microscopy for the study of molecular-beam epitaxy-grown n-type Hg1-xCdxTe (x = 0.22) films subjected to various operations used in the fabrication of p +-n photodiode structures. The operations included arsenic ion implantation, activation annealing and extra annealings aimed at investigation of the details of the p +-n junction formation. A detailed chara… Show more

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Cited by 7 publications
(2 citation statements)
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“…This variable concentration and band gap heterostructure were usually grow by molecular beam epitaxy (MBE) or metal organic chemical vapor deposition (MOCVD). The P + -type HgCdTe layer fabricated by MBE is achieved by arsenic(As) doping, followed by high temperature annealing to activate As [21,22]. High temperature annealing is required because the implanted As existed as Asx cluster, which should become As atom to substitute the Te to accomplish the role of p-type doping.…”
Section: Introductionmentioning
confidence: 99%
“…This variable concentration and band gap heterostructure were usually grow by molecular beam epitaxy (MBE) or metal organic chemical vapor deposition (MOCVD). The P + -type HgCdTe layer fabricated by MBE is achieved by arsenic(As) doping, followed by high temperature annealing to activate As [21,22]. High temperature annealing is required because the implanted As existed as Asx cluster, which should become As atom to substitute the Te to accomplish the role of p-type doping.…”
Section: Introductionmentioning
confidence: 99%
“…В частности, не всегда может быть реализована диодная p−n-структура, обеспечивающая эффективную инжекцию электронов и дырок в активную область. Например, существуют технологические трудности при создании полупроводниковых слоев с p-типом проводимости в материалах HgCdTe или AlGaN [6][7][8][9]. Как альтернатива прямой токовой накачке может использоваться оптическая накачка или накачка электронным лучом, что не всегда эффективно или же может значительно усложнять систему.…”
Section: Introductionunclassified