Electrical and Optical Chip I/O Interconnections for Gigascale Systems

Power delivery, signaling and cooling for 2D and 3D integrated systems

“…One such derivative is shown in Figure 2.10, which illustrates the ability to embed each optical pin in a solder bump to create a dual-mode electricaloptical solder bump [31]. An SEM image of such dual-mode electrical-optical solder bumps is shown in Figure 2 In another approach, the optical and electrical I/Os can be assembled without having to embed the polymer pins in the solder bumps [32], as illustrated in Figure 2.7 and Figure 2.12. In order to adhere the optical I/Os to the waveguides on the substrate, the die containing the electrical and optical I/Os is dipped into a thin layer of a polymeric adhesive before bonding.…”

3D Integrated Circuits: Liquid Cooling and Power Delivery

“…In other words, the 3D technology under consideration combines all critical interconnect functions (power, signal and thermal) for a gigascale system [24]. Details of the optical interconnects proposed for the 3D system under consideration and its advantages to other optical interconnect technologies can be found in [25][26][27]. This paper will focus on the cooling and power delivery aspects.…”