Electrical Breakdown Characteristics of Epoxy/Hollow Silica Composite Materials

Matsubara, Toshikazu; Kawashima, T.; Hozumi, Naohiro; Murakami, Yoshinobu

doi:10.1109/ceidp.2018.8544815

Cited by 2 publications

(2 citation statements)

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“…The results for EP/h‐SiO 2 ‐10 samples presented in Figure were indicative of existence of hollow regions, voids at the interface between hollow silica and EP or other sites as partial discharge origins. On the other hand, one can conclude that partial discharges determining dielectric breakdown do not occur in hollow silica regions in EP/h‐SiO 2 ‐10 samples under the experimental conditions considering that PD characteristics remain same irrespective of the presence or absence of hollow silica regions as shown in Figures and , that AC 0p ‐BDV values are nearly same as AC 0p ‐BDV (AC 0p ‐Fb) in Figure , and that measured PDIV in samples with a single hollow particles and voltage borne by the hollow region (estimated by electric field analysis) are much higher that Paschen voltage at 1 atm . This is suggestive of a breakdown process in which microvoids and other defects at the EP/SiO 2 interface work as an electrical weak point.…”

Section: Resultsmentioning

confidence: 77%

“…On the other hand, one can conclude that partial discharges Figure 8, and that measured PDIV in samples with a single hollow particles and voltage borne by the hollow region (estimated by electric field analysis) are much higher that Paschen voltage at 1 atm. 13 This is suggestive of a breakdown process in which microvoids and other defects at the EP/SiO 2 interface work as an electrical weak point.…”

Section: Dielectric Breakdown Testsmentioning

confidence: 99%

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Basic electrical characteristics of epoxy/hollow silica composites influenced by addition of hollow silica

Murakami

Matsubara

Kawashima

et al. 2019

Elect Comm in Japan

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Polymeric insulating materials like an epoxy resin due to their excellent electric performance and a maintenance performance are commonly applied to various power equipment. Additives and fillers are traditionally added into the epoxy resin to improve the mechanical and thermal properties. The epoxy/hollow particle composites have been developed to produce the composite material which has new function like the low dielectric constant, the lightweight, and the high heat insulation. To understand the basic electrical properties of epoxy/hollow silica composites, the capacitance measurement, the breakdown test and the partial discharge measurements were performed. The breakdown strength of the epoxy/hollow silica composites and the breakdown strength of the epoxy/no hollow silica (normal silica) composites were almost the same regardless of the applied voltage waveform. The AC breakdown voltage at the 0‐peak of the epoxy/hollow silica composites also agreed with the DC breakdown voltage of that. Furthermore, the PDIV of the epoxy/hollow silica composites was almost the same compared to that of epoxy/normal silica composites. The continuous partial discharge in the hollow region did not cause the breakdown, and the existence of the interface between the silica particle and the epoxy resin might lead to the breakdown.

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Section: Resultsmentioning

confidence: 77%

Section: Dielectric Breakdown Testsmentioning

confidence: 99%