Electrical Characteristics of a New Class of Conductive Adhesive

Abstract

Conventional conductive adhesives are composed of micro-sized filler metal and polymer matrix. Currently, the conductivity of conventional conductive adhesives is generated by small contact points formed among the particles during the curing process and by the tunneling effect. Therefore, conventional conductive adhesives generally exhibit higher electrical resistance than metal solder materials. In this study, a new class of conductive adhesive, composed of nano-particles and micro-particles in epoxy, was developed to improve electrical conductivity. This study used four conventional conductive adhesives (CCA1 to 4) and three hybrid conductive adhesives (HCA1 to 3). Scanning electron microscopy (SEM) observation was used to investigate the configuration of nano-particles and micro-particles. The electrical resistance of HCA1 to 3 was investigated and compared to CCA1 to 4 using a four-point probe method. When 2 mass% of nano-particle content was added to the micro-particle (HCA1), the electrical resistance decreased compared to CCA3. At 4 mass% of nano-particle content (HCA2), the electrical resistance value was similar to CCA3. However, at 8 mass% of nano-particle content (HCA3), the electrical resistance continued to increase, and exceeded that of CCA3.

Influence of Nano-CaCO3 Particles on Shear Strength of Epoxy Resin Adhesives

“…Epoxy adhesives are commonly used in applications in aerospace, automotive, marine and construction industries due to their adhesive strength, durability and toughness, chemical resistance, ease of application (Lu, 2000;Jeong, 2005;Jiang, 2005;Tan, 2006;Tee, 2007;Zhrang, 2016). Recently, the mechanical properties enhancement of the epoxy adhesives has been performed by the use of nanoparticle reinforcement such as nano-rubber particles, carbon nanotubes, graphene and silver nanowires, nano-clay, alumina and silica nanoparticles (Khoee, 2010;Sydlik, 2013;Fu, 2014;Wu, 2006;Xian, 2006;Kim, 2013;Ulus, 2016).…”

Polyaniline‐tailored electromechanical responses of the silver/epoxy conductive adhesive composites

“…In recent years, there is an increasing interest in the development of composites composed of two or more filler components to improve the performance and to reduce cost . Mixture of microscale and nanoscale particles or mixture of metallic and conductive polymer fillers has been used to improve the electrical conductivity of ECAs and to reduce cost . Conductive polymer composites have also been used in the development of smart materials and structures in which the conductive fillers can response to the external (electric and magnetic) fields by aligning to the field direction; the resultant anisotropic structures have a pronounced force‐dependent conductivity or piezoresistivity …”

Effects of Trace Elements in Copper Fillers on the Electrical Properties of Conductive Adhesives

“…Various conductive fillers such as Ag, Ni, Cu, carbon black, carbon fiber, graphite powders, and carbon nanotubes are applied to create conductive adhesives. [5][6][7][8][9][10][11][12][13][14][15][16][17][18][19] Silver flakes and spherical particles are the most commonly used metallic fillers for conductive adhesives, but have the disadvantage of being relatively expensive. Therefore, alternative materials such as copper and nickel are used as the metallic fillers to manufacture low-cost conductive adhesives.…”