2024 8th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) 2024
DOI: 10.1109/ltb-3d64053.2024.10774126
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Electrical Characteristics of Thick-Metal-Film Interconnects on Silicon Oxide Films by Directly Bonding Al Foils

Saki Murotani,
Sakura Uehara,
Jianbo Liang
et al.
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