Electrical Characterization of a Microstrip Line Patterned by Electrohydrodynamic Jet Printing of Silver Nanoparticles

Lee, Dae-Young; Lím, D.; Kim, Yong-Jun; Hwang, Jungho

doi:10.2352/j.imagingsci.technol.2009.53.4.041203

Cited by 2 publications

(2 citation statements)

References 10 publications

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“…Extensive reviews on such inks for printed‐electronics applications can be found elsewhere . Silver nanoparticles are the most widely studied material for patterning conductive tracks by e‐jet printing . A common approach is to use silver nanoparticles suspended in an organic solvent as the ink.…”

Section: Applications Of E‐jet Printingmentioning

confidence: 99%

Mechanisms, Capabilities, and Applications of High‐Resolution Electrohydrodynamic Jet Printing

Önses

Sutanto

Ferreira

et al. 2015

Small

499

397

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This review gives an overview of techniques used for high-resolution jet printing that rely on electrohydrodynamically induced flows. Such methods enable the direct, additive patterning of materials with a resolution that can extend below 100 nm to provide unique opportunities not only in scientific studies but also in a range of applications that includes printed electronics, tissue engineering, and photonic and plasmonic devices. Following a brief historical perspective, this review presents descriptions of the underlying processes involved in the formation of liquid cones and jets to establish critical factors in the printing process. Different printing systems that share similar principles are then described, along with key advances that have been made in the last decade. Capabilities in terms of printable materials and levels of resolution are reviewed, with a strong emphasis on areas of potential application.

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Section: Applications Of E‐jet Printingmentioning

confidence: 99%

Mechanisms, Capabilities, and Applications of High‐Resolution Electrohydrodynamic Jet Printing

Önses

Sutanto

Ferreira

et al. 2015

Small

499

397

View full text Add to dashboard Cite

show abstract

“…In the last few years, several research works were presented on patterning of metal nanoparticles through e-jet printing on glass and silicon substrate [23][24][25][26][27] and droplet analysis using different forms of voltage [28][29][30][31]. However, there were always controllability and residue charge problems.…”

Section: Ac-pulse Modulated E-jet Printing System and Processmentioning

confidence: 99%

AC-pulse modulated electrohydrodynamic jet printing and electroless copper deposition for conductive microscale patterning on flexible insulating substrates

Qin

Dong

Lee

2017

Robotics and Computer-Integrated Manufacturing

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This paper presents a novel micro-manufacturing method for fabrication of electrical features and patterns on highly insulating substrates and flexible substrates based on high-resolution AC-pulse modulated electrohydrodynamic jet (e-jet) printing of silver nanoink as seed layer followed by electroless copper deposition. Traditional ink jet printing method is limited in printing resolution which is determined by dimension of printing nozzle and dimension of droplets. Traditional e-jet printing has the disadvantage of residual charge problem especially for highly insulating substrates which cannot dredge remained charge of printed droplets, resulting in distorted electrostatic field and low printing controllability. Meanwhile, for printing of liquid phase ink, feature resolution contradicts with the required thickness, which is a key factor of conductivity of printed patterns. In this paper, a novel ACmodulated e-jet printing technique is applied to neutralize charges on substrates by switching polarity of consequent droplets for direct printing of high-resolution conductive silver patterns on insulating substrates. Electroless copper deposition is introduced in the fabrication process to solve the thickness problem of the resulting features. Variables of fabrication process, including amplitude and frequency of AC-pulsed voltage, plotting speed, curing temperature, number of layers, concentration of solution for copper growth, were identified to achieve reliable and conductive printed patterns. Sub-20µm silver tracks with resistivity about 3.16 times of bulk silver were successfully fabricated. We demonstrated that ac-pulse modulated e-jet printing followed by electroless copper deposition can produce high resolution conductive patterns with improved thickness on insulating substrates and flexible substrates, which can be applied to direct printing and micro scale patterning for flexible electronics and wearable devices applications.

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Electrical Characterization of a Microstrip Line Patterned by Electrohydrodynamic Jet Printing of Silver Nanoparticles

Cited by 2 publications

References 10 publications

Mechanisms, Capabilities, and Applications of High‐Resolution Electrohydrodynamic Jet Printing

Mechanisms, Capabilities, and Applications of High‐Resolution Electrohydrodynamic Jet Printing

AC-pulse modulated electrohydrodynamic jet printing and electroless copper deposition for conductive microscale patterning on flexible insulating substrates

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