Electrical characterization of annular through silicon vias for a reconfigurable wafer-sized circuit board

Diop, Mamadou Diobet; Radji, Moufid; Andre, Walder; Blaquiere, Yves; Hamoui, A.A.; Izquierdo, Ricardo

doi:10.1109/epeps.2010.5642596

Cited by 7 publications

(2 citation statements)

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“…TSVs also provide Joint Test Action Group signals to configure the WaferIC internal circuitry prior to operation. The electrical characterization of TSVs at wafer level used for this application was done in [6]. PowerBlocks are attached to the backside wafer by a flip-chip process and are constituted of an array of miniature PCBs that integrate regulators to supply dc power to the backside wafer.…”

Section: Introductionmentioning

confidence: 99%

Evaluation of Anisotropic Conductive Films Based on Vertical Fibers for Post-CMOS Wafer-Level Packaging

Diop¹,

Radji

Hamoui

et al. 2013

IEEE Trans. Compon., Packag. Manufact. Technol.

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Abstract-In this paper, we investigate the mechanical and electrical properties of an anisotropic conductive film (ACF) on the basis of high-density vertical fibers for a wafer-level packaging (WLP) application. As part of the WaferBoard, a reconfigurable circuit platform for rapid system prototyping, ACF is used as an intermediate film providing compliant and vertical electrical connection between chip contacts and a top surface of an active wafer-size large-area IC. The chosen ACF is first tested by an indentation technique. The results show that the elastic-plastic deformation mode as well as the Young's modulus and the hardness depend on the indentation depth. Second, the efficiency of the electrical contact is tested using a uniaxial compression on a stack comprising a dummy ball grid array (BGA) board, an ACF, and a thin Al film. For three bump diameters, as the compression increases, the resistance values decrease before reaching low and stable values. Despite the BGA solder bumps exhibit plastic deformation after compression, no damage is found on the ACF film. These results show that vertical fiber ACFs can be used for nonpermanent bonding in a WLP application.

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Section: Introductionmentioning

confidence: 99%

Evaluation of Anisotropic Conductive Films Based on Vertical Fibers for Post-CMOS Wafer-Level Packaging

Diop¹,

Radji

Hamoui

et al. 2013

IEEE Trans. Compon., Packag. Manufact. Technol.

Self Cite

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show abstract

“…As depicted in figure 1(b), the top surface of the active wafer is covered by an anisotropic conductive film (ACF). This anisotropic Z-axis film comprises as many as 80 million conductive fibers (BtechCorp, 2011, Diop, 2010. It establishes electrical contact between the NanoPads and the balls of ICs deposited on the surface by the user.…”

Section: Introductionmentioning

confidence: 99%