1982
DOI: 10.1007/bf00752262
|View full text |Cite
|
Sign up to set email alerts
|

Electrical conduction and breakdown properties of silicon nitride films

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
1
1
1

Citation Types

0
3
0

Year Published

2010
2010
2023
2023

Publication Types

Select...
4
1

Relationship

0
5

Authors

Journals

citations
Cited by 5 publications
(3 citation statements)
references
References 34 publications
0
3
0
Order By: Relevance
“…The breakdown voltage V c is related to the dielectric strength for an ideal capacitor by V c = dE c , where d is the thickness of the dielectric. There have been many studies into dielectric strengths showing an inverse power law relation E c ∝ d −n [64][65][66][67][68][69][70]. The results show a typical range of values (0.5 − 1) for the scaling parameter n. Although decreasing the thickness will increase the dielectric strength this will not increase the breakdown voltage if the scaling parameter lies below one.…”
Section: Electrical Characteristics a Voltage Breakdown And Surface F...mentioning
confidence: 99%
“…The breakdown voltage V c is related to the dielectric strength for an ideal capacitor by V c = dE c , where d is the thickness of the dielectric. There have been many studies into dielectric strengths showing an inverse power law relation E c ∝ d −n [64][65][66][67][68][69][70]. The results show a typical range of values (0.5 − 1) for the scaling parameter n. Although decreasing the thickness will increase the dielectric strength this will not increase the breakdown voltage if the scaling parameter lies below one.…”
Section: Electrical Characteristics a Voltage Breakdown And Surface F...mentioning
confidence: 99%
“…The Poole-Frenkel charge transport model [4] can be used to describe a bulk limiting field enhanced thermal ionization of the trapped electrons (illustrated in Figure 6). In the model, J is the current density, E is the electric field, Φ B is the barrier height, ε is dynamic permittivity which equals to ε 0 ε D , ε D is dynamic dielectric constant, C 1 is a constant to be fitted.…”
Section: Conduction Mechanism Studymentioning
confidence: 99%
“…Popular dielectric thin films, like SiO 2 and Si 3 N 4 , are well understood and extensively used. It is known that primary charge transport mechanisms in these films are Fowler-Nordheim tunneling and Poole-Frenkel emission effects [3][4]. However, these films have limitations for MEMS, where harsh environment-resistant is needed because of exposure to release chemicals during fabrication and corrosive media during field use.…”
Section: Introductionmentioning
confidence: 99%