Silicon telluride Si T e is a p-type semiconductor with hexagonal layer structure and space group p3ml /1, 2/. The crystallographic c-axis is perpendicular to the layers. The crystals a r e strongly hygroscopic and even t r a c e s of water vapour cause a chemical reaction. A s a result Si02 and free tellurium are deposited on the sample surface /3, 4/. F o r electrical measurements on high resistivity Si2Te3 it is necessary to avoid this reaction o r to restore the original low conductivity of the surface.
5In a previous investigation /5, 6/ the samples were cleaved in high vacuum before the evaporation of gold contacts. During the transfer to the measurement apparatus, however, the samples were exposed to the laboratory atmosphere. Therefore the surface reaction produced a tellurium film, which was removed by a vacuum heat treatment a t 520 K. The reproducibility of the experimental results was not satisfactory.In this note we used an ultra-high vacuum equipment to avoid chemical surface reactions. In this apparatus it was possible to clean the samples, to apply gold contacts by evaporation, and to perform measurements of the electrical conductivity under permanent vacuum conditions. T o obtain clean sample surfaces we cleaved the samples with the help of an adhesive tape o r sputtered the crystal surfaces with an argon ion beam. With the first method, however, it was not possible to obtain two parallel sample surfaces perpendicular to the c-axis as good cleavage planes. Therefore the measurement of the electrical conductivity parallel t o the c-axis was only feasible with sputtered samples. The crystals were grown by transport in the vapour phase /2, 7/. The samples were platelets of 70 to 100 p m thickness and 40 t o 50 m m a r e a . The sputtering was performed at an argon p r e s s u r e of 1 0 2 -4 mbar, the typical 1 ) Kaiserstr. 12, D-7500 Karlsruhe, FFG.