Electrical connections to the thermal conduction modules of the IBM Enterprise System/9000 water-cooled processors

Brofman, Peter J.; Ray, Siddharth S.; Beckham, K.

doi:10.1147/rd.365.0921

Cited by 11 publications

(3 citation statements)

References 15 publications

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“…Figure 3 shows an expanded cutaway view of the module. Several of the IBM mainframe Enterprise systems have utilized glassceramic technology in past years [3,4]. Like these earlier systems, this advanced MCM was based on glass-ceramic technology to take advantage of its low dielectric constant However, these past systems had more than 20 chips per module and also used MCM-D technology in which sintered copper wiring and copper/polyimide multilayer thin-film technology was used to provide the chip-tochip interconnection [3,5,6].…”

Section: Packaging Overviewmentioning

confidence: 99%

“…When first introduced, the bipolar devices typically contained a total of 120 to 200 C4 solder ball connections, with a C4 pitch of 250 m. These early low-I/O-count devices were attached to a multilayer ceramic substrate made of alumina. Since the introduction of ES/9000* in 1990, IBM has been using glass-ceramic MCM modules with copper internal wiring for high-end servers [3,4]. In addition, the glass-ceramic MCMs used in previous high-end servers have utilized thin-filmdeposited wiring on the top surface of the substrate.…”

Section: C4 Flip-chip Joining Rework and Underfillmentioning

confidence: 99%

“…The Regatta glass-ceramic substrate has a nonplanar thick-film top-and bottom-surface metallurgy which is different from those used in previous glass-ceramic substrates. The previous thin-film top-surface metallurgy consisted of Cr/Cu/Ni/Au which, in the first generation of glass-ceramic technology, was deposited by electron-beam evaporation [3,4]. More recent glass-ceramic modules have used an electroplated Cu/Ni/Au TSM with a sputtered Cr/Cu seed layer [11,12].…”

Section: Chip Joinmentioning

confidence: 99%

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An advanced multichip module (MCM) for high-performance UNIX servers

et al. 2002

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In 2001, IBM delivered to the marketplace a high-performance UNIX ® -class eServer based on a four-chip multichip module (MCM) code named Regatta. This MCM supports four POWER4 chips, each with 170 million transistors, which utilize the IBM advanced copper back-end interconnect technology. Each chip is attached to the MCM through 7018 flip-chip solder connections. The MCM, fabricated using the IBM high-performance glass-ceramic technology, features 1.7 million internal copper vias and high-density topsurface contact pad arrays with 100-m pads on 200-m centers. Interconnections between chips on the MCM and interconnections to the board for power distribution and MCM-to-MCM communication are provided by 190 meters of co-sintered copper wiring. Additionally, the 5100 off-module connections on the bottom side of the MCM are fabricated at a 1-mm pitch and connected to the board through the use of a novel land grid array technology, thus enabling a compact 85-mm ؋ 85-mm module footprint that enables 8-to 32-way systems with processors operating at 1.1 GHz or 1.3 GHz. The MCM also incorporates advanced thermal solutions that enable 156 W of cooling per chip. This paper presents a detailed overview of the fabrication, assembly, testing, and reliability qualification of this advanced MCM technology.

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