Electrical Contact Performance of Cu Alloy under Vibration Condition and Acetal Glue Environment

Abstract

In view of the serious sliding electrical contact performance caused by external vibration and environmental contaminant, a study on the tribological characteristic and contact resistance of Cu alloy was conducted using a self-developed micro-load reciprocating electric contact device. Various glue concentrations (0%, 10%, 30%, and 50%) were prepared with anhydrous ethanol and deposited on the surface of a pure copper block via the deposition method. An external vibration source was installed on the sliding module to achieve vertical vibration. The results indicate that the final contact resistance and coefficient of friction (COF) in direct metal contact are about 0.01 Ω and 0.3, respectively. At this time, the wear volume is 2 to 3 orders of magnitude higher than the condition with glue residual. As glue concentration is above 10%, residual glue on the surface of Cu alloy hinders efficient contact between friction pairs, resulting in higher contact resistance. Glue exhibits lubrication, anti-wear, and insulation properties. External vibration causes friction pairs to briefly separate, leading to a lower glue removal capacity than that under non-vibration conditions. The contact resistance with glue addition under vibration conditions is higher than that under non-vibration conditions at 3 × 104 cycles. The dominant oxide product is CuO, which has a limited effect on contact resistance.