Nb2O5,
Ta2O5,
and
Al2O3
solid solutions and nanolaminates were grown using atomic layer deposition technique. Electrical properties of the materials deposited were comparatively characterized by studying the behavior of Al/niobium-aluminum (tantalum) oxide/indium-tin oxide capacitor structures. The films with high Nb content demonstrated high polarizability and leakage current density. The films with high Al content demonstrated low leakage current densities. The leakage currents in Nb-based films were reduced by depositing thin alternate layers of
Al2O3
or
Ta2O5
and
Nb2O5,
thereby increasing the number of interfaces between distinct oxide layers. The permittivity of
Nb2O5:Al2O3
films could be increased with
Nb2O5
concentration without considerable loss in resistivity. © 2001 The Electrochemical Society. All rights reserved.