Electrical reliability and breakdown mechanisms in single-walled carbon nanotubes

Abstract

We show that single-walled carbon nanotubes can carry current densities > 1 MA/cm 2 for several hours but degrade over time at rates that depend on initial input power. Above a current threshold maximum, we observe large scale physical migration at the CNT-Au electrode interface, which results in Au voids as large as 300 nm in diameter and nearby mounds 3x as tall as the original 50 nm structure. We suggest that the likely mechanism for this void and mound growth is either localized melting, thermomigration, electromigration, or some combination of these. We also show two unique end-oflife breakdown mechanisms for CNTs, a classical fracture via resistive breakdown, and a physically intact but nonconducting failure mode.

Cobra: A comprehensive bundle-based reliable architecture

“…Unfortunately, since a single permanent defect is sufficient to disable an entire core, this solution is only viable for systems subjected to a limited number of faults. As emerging technologies promise to deliver massive integration of highly unreliable nanodevices [26], a scenario where digital systems are affected by a large number of failures is likely. Therefore, future computers will require novel architectures that can perform even when faced with high fault rates.…”