2017 IEEE 67th Electronic Components and Technology Conference (ECTC) 2017
DOI: 10.1109/ectc.2017.34
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Electrical Transmission Properties of HBM Interface on 2.1-D System in Package Using Organic Interposer

Yutaka Uematsu
1
,
Nobuyuki Ushifusa
2
,
Hitoshi Onozeki
3
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Cited by 25 publications
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