Electrically Conductive Adhesives: A Research Status Review

Morris, James E.; Liu, Johan

doi:10.1007/0-387-32989-7_40

Cited by 19 publications

(13 citation statements)

References 51 publications

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“…As the thermomechanical properties of Ag, such as the coefficient of thermal expansion (CTE) and the elastic modulus, are very different from those of the adhesive matrix [3], a large fraction of Ag particles in a conventional ICA causes high local stress induced in the bulk of the material. This is believed to be the main source for the poor mechanical performance of the conventional ICAs in environmental stress tests, such as drop (impact) tests and thermomechanical cycling [1], [4]. Poor mechanical performance in various demanding conditions, particularly poor impact strength, is the primary obstacle to widespread industrial adoption of the ICA technology [4].…”

Section: Introductionmentioning

confidence: 99%

“…ICAs can offer advantages over solder technology, such as environmental friendliness (elimination of lead usage and flux cleaning), lower processing temperature, fewer processing steps, and hence lower cost [1], [2]. An ICA consists of a polymeric adhesive matrix filled with electrically conductive particles.…”

Section: Introductionmentioning

confidence: 99%

“…Poor mechanical performance in various demanding conditions, particularly poor impact strength, is the primary obstacle to widespread industrial adoption of the ICA technology [4]. The impact strength of ICAs is normally evaluated using a drop test standard devised by the National Center for Manufacturing Sciences (USA) [1], [2]. In this test, assemblies consisting of a chip carrier mounted on a FR4 circuit board using an ICA are dropped onto a hard surface from a height of 1.5 m (60 in).…”

Section: Introductionmentioning

confidence: 99%

“…The mechanical strength of the ICA joint comes from the matrix, while the particles provide electrical conductivity. Traditional ICA compounds are loaded with 25-30 vol% (up to 80 wt%) of solid silver (Ag) particles (typically in flake form) to ensure the required electrical conductivity [1]. As the thermomechanical properties of Ag, such as the coefficient of thermal expansion (CTE) and the elastic modulus, are very different from those of the adhesive matrix [3], a large fraction of Ag particles in a conventional ICA causes high local stress induced in the bulk of the material.…”

Section: Introductionmentioning

confidence: 99%

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Die Shear Testing of a Novel Isotropic Conductive Adhesive—Epoxy Filled With Metal-Coated Polymer Spheres

Nguyen

Andreassen

Kristiansen

et al. 2013

IEEE Trans. Compon., Packag. Manufact. Technol.

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Isotropic conductive adhesives (ICAs) filled with metal-coated polymer spheres (MPS) are introduced to improve the mechanical reliability compared with conventional ICAs filled with silver (Ag) flakes. This paper deals with the die shear performance of an MPS-based ICA; an epoxy filled with 45 vol% of Ø 30 µm Ag-coated monodisperse polymer spheres. The curing kinetics of the ICA is also studied. The MPS-based ICA is compared with two ICAs filled with Ag flakes: an in-house prepared ICA (with the same epoxy matrix as the MPS-based ICA) and a commercially available ICA. Both ICAs with Ag flakes have a lower particle volume fraction than the MPS-based ICA. Loading 45 vol% of MPS into the epoxy matrix has no significant effect on the curing kinetics and the glass transition temperature (T g ) of the matrix. The MPS-based ICA has 140% higher die shear strength than the in-house prepared ICA with Ag flakes, and 23% higher die shear strength than the commercial ICA with Ag flakes. The MPS-based ICA also has higher shear strain at failure, and less scatter in shear strength between repeated tests. Hence, the MPS-based ICA has a good potential for demanding applications; it has better die shear performance and higher T g than the commercial ICA with Ag flakes.Index Terms-Isotropic conductive adhesive (ICA), metalcoated polymer spheres (MPS), shear test, stiffness.

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Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

See 2 more Smart Citations

Die Shear Testing of a Novel Isotropic Conductive Adhesive—Epoxy Filled With Metal-Coated Polymer Spheres

Nguyen

Andreassen

Kristiansen

et al. 2013

IEEE Trans. Compon., Packag. Manufact. Technol.

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“…These advantages include, for instance, simple processing, low processing temperatures, no flux residues, no underfilling and fine pitch capability [1] [2][3] [4]. ACAs comprise a non-conductive, usually polymer resinbased, matrix with conductive particles as filler material.…”

Section: Introductionmentioning

confidence: 99%

Thermal cycling reliability analysis of an anisotropic conductive adhesive attached large-area chip with area array configuration

Kiilunen

Lahokallio

Frisk

2015

2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC)

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The reliability of adhesive flip chip attachments was studied. A large-area chip with a great number of contacts was attached onto a flexible polyimide substrate using anisotropic conductive adhesive film (ACF). The test samples were manufactured using various bonding forces and the reliability of the assemblies was examined using a thermal cycling test. Two temperature change rates were used in the cycling test to study the effect of the change rate on the observed failure times and modes. The results show that the ACF flip chip attachment of large-area chips with matrix array interconnections is an applicable technique. Furthermore, a significant increase in the reliability of the assemblies was obtained by increasing the bonding force. However, early failures were observed in all the samples, especially in the outermost adhesive interconnections. Failure analysis performed on the samples exhibiting early failures showed signs of adhesive delamination and silicon chip cracking. No clear differences in the results between the two temperature cycling tests used were observed. However, the faster temperature change rate seemed to cause a higher number of early failures.

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Electrical characterization of individual metal‐coated polymer spheres used in isotropic conductive adhesives

Nguyen

Helland

et al. 2016

J of Applied Polymer Sci

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Isotropic conductive adhesives (ICAs) filled with metal‐coated polymer spheres (MPS) have been proposed to improve the mechanical reliability compared to conventional ICAs filled with silver flakes. The electrical properties of MPS play an important role in the electrical performance of macroscopic MPS‐based ICAs. This article deals with the electrical characterization of individual MPS using a nanoindentation‐based flat punch method, in which the resistance and the deformation of single MPS were monitored simultaneously. Four groups of silver‐coated polymer spheres (AgPS) with identical polymer cores but different silver coating thicknesses were tested. The resistance of AgPS decreases gradually with increasing deformation degree of particles, and increases when the deformation of particles is reduced. In addition, the resistance of individual AgPS is dependent on the physical properties of the silver coating, such as thickness, uniformity, and porosity. The thicker the silver coating is, the lower and more stable the resistance of AgPS is. © 2016 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2016, 133, 43764.

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Electrically Conductive Adhesives: A Research Status Review

Cited by 19 publications

References 51 publications

Die Shear Testing of a Novel Isotropic Conductive Adhesive—Epoxy Filled With Metal-Coated Polymer Spheres

Die Shear Testing of a Novel Isotropic Conductive Adhesive—Epoxy Filled With Metal-Coated Polymer Spheres

Thermal cycling reliability analysis of an anisotropic conductive adhesive attached large-area chip with area array configuration

Electrical characterization of individual metal‐coated polymer spheres used in isotropic conductive adhesives

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