Al-and B-doped 3C-SiC ceramics were prepared by hot-pressing powder compacts containing submicrometer-sized b-SiC, precursors of 5 wt% nanosized b-SiC, and an optional additive (Al or B) in an Ar atmosphere. Electron probe microanalysis (EPMA) investigation on the obtained specimens revealed that a portion of the doped Al and B atoms substituted the zinc blende lattice sites. The temperature-dependent electrical resistivity data of the Al-and B-doped SiC specimens were measured in the 4-300 K range and compared with those of an undoped specimen. The Al-and B-doped SiC specimens exhibited resistivities that were as high as~10 3 Ω cm at room temperature and~10 5 and~10 4 Ω cm, respectively, below 100 K. These values are larger than those of the undoped SiC specimen by a factor of~10 4 . Such high resistivities of the impurity-doped specimens are attributable to the carrier compensation by the Al-and B-derived acceptors located well above the valence-band edge of 3C-SiC. Photoluminescence investigation revealed that the Al-and B-doped specimens exhibited emission profile below 2 eV, implying the existence of the acceptors.For undoped, Al-doped, and B-doped SiC, submicrometersized b-SiC (Ultrafine, Betarundum; Ibiden Co. Ltd, Ogaki, Japan), polysiloxane (1036 kg/m 3 ; GE Toshiba Silicones Co. Ltd., Tokyo, Japan), phenol resin (1090 kg/m 3 ; Kangnam Chemical Co. Ltd., Incheon, Korea), and an optional additive, Al (3 lm, >99.9%; High Purity Chemicals Ltd., Tokyo, Japan) or B (<1.0 lm, 95%-97%; TangShan WeiHao R. Riedel-contributing editor