Electrically removable, micromachined encapsulation for sensitive materials

Roth, M.; Vogel, Steffan; Schaber, U.; Endres, H.-E.

doi:10.1016/s0924-4247(97)01482-9

Cited by 3 publications

(2 citation statements)

References 4 publications

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“…An innovative idea is proposed for the automation of the sampling, by opening a membrane at a specified moment using a current pulse to expose the culture medium to the container air. The opening of a membrane with a current pulse was first described in Roth et al [18,19]. The air flow forced by the cooling unit from a container causes the mould spores to scatter inside the container.…”

Section: (B) Feasibility Of Mould Detection By Gas Sensor Arraysmentioning

confidence: 99%

Two underestimated threats in food transportation: mould and acceleration

Janssen

Pankoke²,

Klus³

et al. 2014

Phil. Trans. R. Soc. A.

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Two important parameters are often neglected in the monitoring of perishable goods during transport: mould contamination of fresh food and the influence of acceleration or vibration on the quality of a product. We assert the claim that it is necessary to focus research on these two topics in the context of intelligent logistics in this opinion paper. Further, the technical possibilities for future measurement systems are discussed. By measuring taste deviations, we verified the effect on the quality of beer at different vibration frequencies. The practical importance is shown by examining transport routes and market shares. The general feasibility of a mobile mould detection system is established by examining the measurement resolution of semiconductor sensors for mould-related gases. Furthermore, as an alternative solution, we present a concept for a miniaturized and automated culture-medium-based system. Although there is a lack of related research to date, new efforts can make a vital contribution to the reduction of losses in the logistic chains for several products.

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Section: (B) Feasibility Of Mould Detection By Gas Sensor Arraysmentioning

confidence: 99%

Two underestimated threats in food transportation: mould and acceleration

Janssen

Pankoke²,

Klus³

et al. 2014

Phil. Trans. R. Soc. A.

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“…In recent years low temperatures methods have been developed that produce strong and reliable bonds at temperatures (I 20-400C) that are compatible with bipolar and CMOS processes I l-4. Glass-to-Si bonding usually is performed in an anodic manner, see Another wafer level packaging step is the placement of microcaps over an array of (bio-) chemical sensors [11]. 'l'he caps consist of Si3N4 membranes that can be electrically opened by a thermal pulse on the heating resistor ( Figure 4).…”

Section: State Of the Artmentioning

confidence: 99%

<title>MEMS packaging: state of the art and future trends</title>

1998

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Now that the technology for Integrated sensors and MEMS devices has become sufficiently mature to allow mass production, it is expected that the prices of bare chips will drop dramatically. This means that the package prices will become a limiting factor in market penetration, unless low cost packaging solutions become available. This paper will discus the developments in packaging technology. Both single-chip and multi-chip packaging solutions will be addressed. It first starts with a discussion on the different requirements that have to be met; both from a device point of view (open access paths to the environment, vacuum cavities, etc.) and from the application point of view (e.g. environmental hostility). Subsequently current technologies are judged on their applicability for MEMS and sensor packaging and a forecast is given for future trends. It is expected that the large majority of sensing devices will be applied in relative friendly environments for which plastic packages would suffice. Therefore, on the short term an important role is foreseen for recently developed plastic packaging techniques such as precision moulding and precision dispensing. Just like in standard electronic packaging, complete wafer level packaging methods for sensing devices still have a long way to go before they can compete with the highly optimised and automated plastic packaging processes.

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