2021
DOI: 10.1038/s43246-021-00144-z
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Electro-absorption modulation in GeSn alloys for wide-spectrum mid-infrared applications

Abstract: Silicon-based electronic-photonic integrated circuits, which are compatible with state-of-the-art complementary metal-oxide-semiconductor processes, offer promising opportunities for on-chip mid-infrared photonic systems. However, the lack of efficient mid-infrared optical modulators on silicon hinders the utilization of such systems. Here, we demonstrate the Franz-Keldysh effect in GeSn alloys and achieve mid-infrared electro-absorption optical modulation using GeSn heterostructures on silicon. Our experiment… Show more

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Cited by 21 publications
(3 citation statements)
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“…This also gives these prepared heterostructures the chance to be used as UV and IR photodetectors. 58 …”
Section: Resultsmentioning
confidence: 99%
“…This also gives these prepared heterostructures the chance to be used as UV and IR photodetectors. 58 …”
Section: Resultsmentioning
confidence: 99%
“…Prototypes of lasers with electric and optical pumping functioning at temperatures of 90–270 K with emission peaks at 2.3–3.5 μm have been achieved on high-quality Ge/Sn films on germanium and silicon substrates by several groups [ 3 , 4 , 15 , 16 , 17 ]. The emission properties of Ge/Sn nanoparticles with segregated Sn nanoclusters on the surface of germanium nanoparticles [ 18 ], the usage of Ge/Sn layers for hybrid IR photodetectors [ 19 , 20 , 21 ] and adjustable optical modulators, functionalized from 1.8 to 5.0 μm [ 22 , 23 ], have also been demonstrated.…”
Section: Introductionmentioning
confidence: 99%
“…In addition, the Ge lattice is well-matched with GaAs, which could be used as a buffer layer for the III-V integration in silicon photonics [ 8 ]. For other photonic material integration, the Ge buffer layer with high epitaxial quality is also necessary for the growth of GeSnSi materials with direct bandgap properties [ 9 , 10 , 11 , 12 , 13 ]. Growing high-quality Ge on Si is considered an effective approach to make full use of the traditional Si technology and reduce the costs of chips.…”
Section: Introductionmentioning
confidence: 99%