2021 IEEE 4th International Conference on Electronics and Communication Engineering (ICECE) 2021
DOI: 10.1109/icece54449.2021.9674655
|View full text |Cite
|
Sign up to set email alerts
|

Electro-Thermal Model for Schottky Barrier Diode Based on Self-Heating Effect

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
1
1

Citation Types

0
2
0

Year Published

2022
2022
2024
2024

Publication Types

Select...
2
1
1
1

Relationship

2
3

Authors

Journals

citations
Cited by 7 publications
(2 citation statements)
references
References 13 publications
0
2
0
Order By: Relevance
“…The advantage of this structure is that it reduces the number of computational grids to speed up the simulation. The individual diode thermal analysis is convenient in [25,26]. However, the heat flow of the packaging diode is crucial to analyzing the overall temperature distributions and optimizing the thermal flow from the anodes to the waveguide block.…”
Section: D-em and Steady-state Thermal Modelmentioning
confidence: 99%
“…The advantage of this structure is that it reduces the number of computational grids to speed up the simulation. The individual diode thermal analysis is convenient in [25,26]. However, the heat flow of the packaging diode is crucial to analyzing the overall temperature distributions and optimizing the thermal flow from the anodes to the waveguide block.…”
Section: D-em and Steady-state Thermal Modelmentioning
confidence: 99%
“…The individual diode thermal analysis is convenient in [28,29]. However, the heat flow of the packaging diode is crucial to analyzing the overall temperature distributions and optimizing the thermal flow from the anodes to the waveguide block.…”
Section: E-t Model With Thermal Effectsmentioning
confidence: 99%