Electro-thermal modeling of power LED using COMSOL environment

Cuntala, Jozef; Kondelova, Anna; Hock, Ondrej; Pridala, Michal

doi:10.1109/elektro.2016.7512050

Cited by 10 publications

(4 citation statements)

References 6 publications

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“…Since the model is a general one, it must be created for a defined device structure, whereas gathering the full set of construction data for a specific real structure is almost impossible. Therefore, a representative structure corresponding to a real planar GaN LED design for blue-light emission has been completed based on [2] with additional literature research [21,[26][27][28][29][30]. The structure is shown in Figure 2 whereas its basic design data are collected in Table 1.…”

Section: The Model Domainmentioning

confidence: 99%

“…On the other hand, package-oriented or system-oriented simulations are focused not mainly on electrical phenomena but also on thermal or fluidic-thermal phenomena that allow analysing the whole system operation under defined environmental conditions. In these cases, more complex finite element or finite volume methods are used to solve a set of partial differential equations [26,27], or alternative compact models [28][29][30] or their combination [31,32] can be applied. Here, a device is treated as a black box with defined properties, although a new compact model that includes a device-oriented approach has been proposed in the Delphi4LED project [33,34].…”

Section: Introductionmentioning

confidence: 99%

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Numerical Model of Current Flow and Thermal Phenomena in Lateral GaN/InGaN LEDs

2021

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GaN-based light-emitting diodes (LEDs) became one of the most widely used light sources. One of their key factors is power conversion efficiency; hence, a lot of effort is placed on research to improve this parameter, either experimentally or numerically. Standard approaches involve device-oriented or system-oriented methods. Combining them is possible only with the aid of compact, lumped parameter models. In the paper, we present a new electro-thermal model that covers all the complex opto-electro-thermal phenomena occurring within the operating LED. It is a simple and low computational cost solution that can be integrated with package- or system-oriented numerical analysis. It allows a parametric analysis of the diode structure and properties under steady-state operating conditions. Its usefulness has been proved by conducting simulations of a sample lateral GaN/InGaN LED with the aid of ANSYS software. The results presented illustrate the current density and temperature fields. They allow the identification of ‘hot spots’ resulting from the current crowding effect and can be used to optimise the structure.

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Section: The Model Domainmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Numerical Model of Current Flow and Thermal Phenomena in Lateral GaN/InGaN LEDs

2021

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“…All simulations are the set as time domain simulation, so we can determine the influence of studied materials on the speed of the heating of the Mo sheet. [6][7][8][9] As it has been already mentioned, the model is reconfigurable, but for means of this paper the following geometrical parameters are set: Parameters of molybdenum sheet (based on manufactured molybdenum sheets [10,11]): 1000/300/1 (a/b/c) mm, parameters of electrodes: 20/50 (d/h) mm, the electrodes distance: 100 (x) mm. The electrodes are pressed to the Mo sheet with a pressure of 0.3 MPa.…”

Section: Basic Simulation Modelmentioning

confidence: 99%

Modelling of the resistance heating of the moving molybdenum sheet

Pavelek¹,

Frivaldský²,

Špánik³

et al. 2018

Adv. sci. technol. eng. syst. j.

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This article describes the modeling procedure of a direct resistive heat model of the molybdenum sheet and its simulation with electrodes made from various materials. The main characteristic of the proposed model is its dynamic behavior, because model considers the movement of the molybdenum sheet. The simulation results are mutually compared and the optimal material parameters are selected. The development of the model, in which the movement of molybdenum sheet is considered is used for determination of optimal movement speed of the molybdenum sheet in order to achieve requested temperature. The presented model can be also used for determination of optimal electrode materials and its geometrical properties/shape.

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“…However, the analytical model presented concerned simple heat sink geometry, where a single LED source was included in the analysis and only the luminous flux Φ was considered. The thermal analysis for a single LED source and the effect of temperature on the luminous flux Φ are presented in the article [41], where CFD (Computational Fluid Dynamics) Comsol software was used for the calculations.…”

Section: Introductionmentioning

confidence: 99%

Modeling of Selected Lighting Parameters of LED Panel

et al. 2020

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Semiconductor light sources are currently the fastest growing and most energy efficient group of light sources used in lighting technology. Their lighting parameters, such as luminous flux, correlated color temperature and color rendering index depend on the value of the forward current, as well as the temperature of the junction. LED source manufacturers usually specify, in data sheets, the effect of junction temperature and forward current on the luminous flux for individual light sources. The difficulty, however, is the correct determination of temperature and then lighting parameters, by simulation methods for multi-source lighting systems. Determining the junction temperature which affects lighting parameters is particulary important in the case of LED panels and luminaires, where thermally coupled LED sources shaping the output lighting parameters are in close proximity to each other. Additionally, other factors influencing the temperature distribution of sources, such as the design and geometry of the cooling system, the design of the printed circuit and thermal interface material used, should be considered. The article is a continuation of the publication in this journal where the influence of factors influencing the temperature distribution of the LED panel is presented. The purpose of the research in this article was to confirm the possibility of using CFD (Computational Fluid Dynamics) software, as well as to determine the accuracy of the results obtained in the temperature analysis of the multi-source LED panel, and in determining the output lighting parameters of the LED panel based on it. In this article, based on previously published research, a LED panel model with a cooling system was made, and then the CFD software determined the junction temperature of all light sources. The determined temperature of the LED sources constituted the basis for determining the output lighting parameters of the panel: luminous flux, color temperature and color rendering index. The simulation results were verified by real measurements on the constructed LED panel prototype. The LED panel temperature difference between the simulation results and the real results on the prototype did not exceed 5%. Moreover, the error of lighting parameters between the simulation results obtained and the results on the LED panel prototype in the worst case was 4.36%, which proves the validity and accuracy of simulation studies.

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Electro-thermal modeling of power LED using COMSOL environment

Cited by 10 publications

References 6 publications

Numerical Model of Current Flow and Thermal Phenomena in Lateral GaN/InGaN LEDs

Numerical Model of Current Flow and Thermal Phenomena in Lateral GaN/InGaN LEDs

Modelling of the resistance heating of the moving molybdenum sheet

Modeling of Selected Lighting Parameters of LED Panel

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