Electro-Thermomechanical Modelling of a BGA Assembly Subjected to a Damaging Displacement and to Random Vibrations

Ghenam, Sinda; Hami, Abdelkhalak El; Akrout, Ali; Gafsi, Wajih; Haddar, Mohamed

doi:10.1007/978-3-030-84958-0_38

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Electro-Thermomechanical Modelling of a BGA Assembly Subjected to a Damaging Displacement and to Random Vibrations

Cited by 2 publications

References 5 publications

Vibration Effect on the Electro-Thermal Mechanical Behavior of the BGA Solder Joints

Vibration Effect on the Electro-Thermal Mechanical Behavior of the BGA Solder Joints

A proposed multiphysics comparison of different alloy compositions for electro-thermomechanical reliability analysis

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