2008
DOI: 10.1007/s10800-008-9674-4
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Electrocatalytic reduction of hydrogen peroxide at nanostructured copper modified electrode

Abstract: The electrocatalytic reduction of hydrogen peroxide (H 2 O 2 ) has been studied at nanostructured copper (Cu nano ) modified glassy carbon (GC/Cu nano ) electrode in phosphate buffer (pH 7.2). The electrical properties of GC/ Cu nano modified electrodes were studied by electrochemical impedance spectroscopy (EIS). Surface and electrochemical characterization were carried out by using atomic force microscopy (AFM) and cyclic voltammetry. A well-defined H 2 O 2 reduction signal, which is due to mediation of a su… Show more

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Cited by 31 publications
(15 citation statements)
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“…The limit of detection (LoD) was calculated to be 1.6  μ M (signal-to-noise ratio ( S / N ) = 3) by substituting the blank standard deviation ( σ = 0.8867) and sensitivity ( m = 1.6546  μ A/ μ M) in the 3σ/m criterion [22]. The response time for each DA addition was observed to be ~3 s, which indicates a fast electron transfer with this modified electrode.…”
Section: Resultsmentioning
confidence: 99%
“…The limit of detection (LoD) was calculated to be 1.6  μ M (signal-to-noise ratio ( S / N ) = 3) by substituting the blank standard deviation ( σ = 0.8867) and sensitivity ( m = 1.6546  μ A/ μ M) in the 3σ/m criterion [22]. The response time for each DA addition was observed to be ~3 s, which indicates a fast electron transfer with this modified electrode.…”
Section: Resultsmentioning
confidence: 99%
“…In several instances lower detection limits have been reported than those found at enzymatic sensors. 46,128,[137][138][139] Several successful examples of these non-enzymatic peroxide sensors have been demonstrated by Bolshakov et al 46 and Lupu et al, 128 who both reported a LOD of 1 nM for their PB films. The former utilised electrodeposited PB on Au microelectrodes, whilst the latter used a polystyrene-based physical templating method to co-deposit polypyrrole and PB.…”
Section: Analytical Areas Of Interest Environmental Sensingmentioning
confidence: 98%
“…Because of its relatively low electrochemical potential, Cu is easily oxidized even in an etchant containing a mild oxidant such as Fe 3+ 51. Therefore, Cu particles loaded on the Si substrate vanished in a typical etchant in a couple minutes, leaving the open question of whether Cu can catalyze the etching of Si, although it has been recently reported that Cu can catalytically reduce H 2 O 2 86…”
Section: Influence Of Noble Metals On the Etchingmentioning
confidence: 99%