2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) 2023
DOI: 10.1109/ectc51909.2023.00078
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Electrochemical Additive Manufacturing: A Novel Approach to Thermal Management of Electronics

Madeline Frank1,
Michael Matthews2,
Joseph Madril3
et al.
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Cited by 3 publications
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CFD Evaluation of Electrochemical Additively Manufactured Heat Sinks for Single-Phase Immersion Cooling

Herring,
Lamotte-Dawaghreh,
Gupta
et al. 2024
2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
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CFD Evaluation of Electrochemical Additively Manufactured Heat Sinks for Single-Phase Immersion Cooling

Herring,
Lamotte-Dawaghreh,
Gupta
et al. 2024
2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
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0
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Thermal Behavior and Visualization of Electrochemical Additive Manufactured Copper Lattice Wicks in a Flat Heat Pipe

Hasan,
Perna,
Winfield
et al. 2024
2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
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CFD Study of Electrochemical Additive Manufacturing Based Cold Plate Designs for Enhanced Electronics Cooling

Lamotte-Dawaghreh,
Herring,
Gupta
et al. 2024
2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
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