Electrochemical behavior of a lead-free SnAg solder alloy affected by the microstructure array

Osório, Wislei R.; Garcia, Leonardo R.; Peixoto, Leandro C.; Garcia, Amauri

doi:10.1016/j.matdes.2011.06.032

Cited by 59 publications

(26 citation statements)

References 37 publications

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“…In case of S040 sample the fine microstructure of IMC array is mainly composed of fibrous and grainy components. As cooling rate was decreasing, the fine structure transformed to plate like structure, which was in good agreement with other related studies [8][9][10][21][22][23] . Due to the reactive nature of the applied electrolyte significant charge transfer was observed in the electrochemical cell during the EIS measurements.…”

Section: S200 S200supporting

confidence: 92%

“…The EIS spectra were analysed by considering the physical processes in the electrochemical reaction and constructing the corresponding equivalent network circuit of the electrochemical system. The free parameters of the model were fitted to the measured data [8][9][10][11][12] . Using the offset voltage, a simpler model of the equivalent network could be applied, consisting of a serial connection of a resistor (R1) and a constant phase element (CPE1).…”

Section: S200 S200mentioning

confidence: 99%

“…One of the most important processes that influences the solder joint, is the corrosion. This is the reason why the corrosion properties of any solder alloy are in the centre of interest [8][9][10][11][12][13] . For revealing corrosion properties of the lead free solder alloys, electrochemical methods are usually applied.…”

Section: Introductionmentioning

confidence: 99%

“…For revealing corrosion properties of the lead free solder alloys, electrochemical methods are usually applied. Osório et al applied different electrochemical measurements in order to find the correlation between microstructure and corrosion properties of solder alloys [8][9][10] . The electrochemical corrosion behaviour of Sn-Cu alloy samples was evaluated by electrochemical impedance spectroscopy (EIS) combined with potentiodynamic polarization.…”

Section: Introductionmentioning

confidence: 99%

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Characterization of the microstructure of tin-silver lead free solder

Hurtony

Szakál

Almásy

et al. 2016

Journal of Alloys and Compounds

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Reliability and lifetime are the two most relevant design considerations in the production of safety critical assemblies. For example in a modern automobile dozens of electronic assemblies are integrated in which thousands of solder joints are mounting the electronic components to the printed circuit boards. There exists no standardised and universal observation method for characterising the fine microstructure of such solder joints. Previously we have developed a new method for the quantitative characterization of lead-free solder alloys and in present study the validity of the proposed method is demonstrated. Microstructure of Sn-3.5Ag lead free solder alloy was investigated by electrochemical impedance spectroscopy. Solder samples were solidified with different cooling rates in order to induce differences in the microstructure. Microstructure of the ingots was revealed by selective electrochemical etching. Electrochemical impedance spectra (EIS) were measured before and after the selective etching process. The complex impedance spectra contain information about microstructure of the solder alloys. Comparison and modelling of two EIS spectra allowed obtaining a characteristic parameter of surface structure of the etched specimens. The EIS measurements were complemented with small angle neutron scattering measurements and scanning electron microscopy, in order to correlate the EIS parameter with the magnitude of the interface of the β-Sn and Ag3Sn phases.

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Section: S200 S200supporting

confidence: 92%

Section: S200 S200mentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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Characterization of the microstructure of tin-silver lead free solder

Hurtony

Szakál

Almásy

et al. 2016

Journal of Alloys and Compounds

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“…In an effort to develop lead-free solders, most research up to now focused on melting points and physical strengths of alloys, and there has been little consideration of the corrosion properties of base alloys for lead-free solders [8][9][10]. Moreover, the properties of these Sn-Bi-Sb lead-free alloys in corrosive environments have not been reported, and most of the fluxes are chloride or fluoride base compounds.…”

Section: Introductionmentioning

confidence: 99%

Effect of Antimony Additions on Corrosion and Mechanical Properties of Sn-Bi Eutectic Lead-Free Solder Alloy

Torres¹,

Narváez²,

Domínguez³

2012

MSA

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The goal of the present work is to investigate the effects of the addition of Sb (0, 3 and 6 wt%) on structure, melting, corrosion and mechanical properties of Sn-Bi eutectic solder alloys. The mechanical properties of the bulk Sn-Bi-Sb solders were higher as the amount of antimony increases, making compressive strength augment from 65 MPa to 100 MPa when 6 wt% Sb was incorporated to the Sn-Bi eutectic alloy. The three alloys presented a melting temperature that is smaller to the one exhibited by the eutectic alloy Sn-38Pb (T m = 183˚C). According to the electrochemical results, the addition of higher contents of Sb to the Sn-Bi eutectic alloy had a positive effect: it ennobled the E corr values.

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The corrosion characteristics and solderability of immersion tin coatings on copper

Araźna

Królikowski

Kozioł

et al. 2012

Materials & Corrosion

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Immersion tin is widely used as a lead free surface finish in the printed circuit board technology. Tin prevents the underlying copper from corrosion and preserves its solderability during a long storage and lead-free assembly processes. Investigated immersion tin coatings were deposited on copper foil from thiourea-type baths with hydrochloric acid addition (SnHCl coatings) or methanesulfonic acid addition (SnMSA coatings). Obtained coatings were investigated in the as deposited state and after aging (4 h at 155 8C, in air). The scanning electron microscopy studies revealed differences in structure of tin samples deposited from different baths. Results of polarization and impedance investigations indicated that as deposited SnHCl coatings had better corrosion resistance in 0.5 M NaCl solution than SnMSA coatings. The aging resulted in the improvement of the corrosion resistance of thinner coatings (0.2 and 0.5 mm thick SnHCl and 0.3 mm thick SnMSA), which were thoroughly converted into Sn-Cu intermetallic (IMC) phases. In contrary, thicker coatings exhibited some worsening of the corrosion resistance upon aging. The solderability of all as-deposited tin coatings was acceptable, but decreased after aging, especially for thinner coatings, showing the through conversion into Sn-Cu IMC phases.

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Electrochemical behavior of a lead-free SnAg solder alloy affected by the microstructure array

Cited by 59 publications

References 37 publications

Characterization of the microstructure of tin-silver lead free solder

Characterization of the microstructure of tin-silver lead free solder

Effect of Antimony Additions on Corrosion and Mechanical Properties of Sn-Bi Eutectic Lead-Free Solder Alloy

The corrosion characteristics and solderability of immersion tin coatings on copper

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