Electrochemical behavior of Mg and some Mg alloys in aqueous solutions of different pH

Badawy, W. A.; Hilal, Nadia H.; El-Rabiee, M.M.; Nady, H.

doi:10.1016/j.electacta.2009.10.083

Cited by 75 publications

(41 citation statements)

References 33 publications

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“…As a chemical reaction, the corrosion of the Mg alloy would cease when an equilibrated concentration of ions is reached in the surrounding fluid. However, under in vivo conditions, the electrolyte concentrations are subjected to homoeostasis, and equilibrium is never reached, leading to the complete material corrosion [115]. Additionally, local changes in electrochemical conditions could also be caused by locally passivated areas that are covered by newly formed bone, which have been observed by µCT.…”

Section: Discussionmentioning

confidence: 94%

Mg and Mg alloys: How comparable are in vitro and in vivo corrosion rates? A review

et al. 2015

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Due to their biodegradability, magnesium and magnesium-based alloys could represent the third generation of biomaterials. However, their mechanical properties and time of degradation have to match the needs of applications. Several approaches, such as choice of alloying elements or tailored microstructure, are employed to tailor corrosion behaviour. Due to the high electrochemical activity of Mg, numerous environmental factors (e.g. temperature and surrounding ion composition) influence its corrosion behaviour, making it unpredictable. Nevertheless, the need of reliable in vitro model(s) to predict in vivo implant degradation is increasing. In an attempt to find a correlation between in vitro and vivo corrosion rates, this review presents a systematic literature survey, as well as an attempt to correlate the different results.

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Section: Discussionmentioning

confidence: 94%

Mg and Mg alloys: How comparable are in vitro and in vivo corrosion rates? A review

et al. 2015

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“…[46][47][48] In acidic conditions, Reactions 1 and 2 (see below) describe the dissolution of CoO and Co(OH) 2 into Co 2+ ions. 46,48,49 Once the native oxide is removed, the dissolution continues according to Reaction 3 50 which can be accelerated by the reduction of dissolved O 2 (Reaction 4). The relatively high DRs observed with just water in the acidic conditions ( Figure 1) are due to the dissolution processes described by Reactions 1-3 which are spontaneous ( G <0) in nature.…”

Section: Resultsmentioning

confidence: 99%

Citric Acid as a Complexing Agent in Chemical Mechanical Polishing Slurries for Cobalt Films for Interconnect Applications

Popuri

Sagi

Alety

et al. 2017

ECS J. Solid State Sci. Technol.

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A colloidal silica-based slurry (3-10 wt%) containing H 2 O 2 (1 wt%) and citric acid (50 mM) was found to polish chemical vapordeposited (CVD) cobalt (Co) films with removal rates (RRs) of ∼180-500 nm/min and a dissolution rate (DR) of ∼0 nm/min at pH 8 along with an RMS roughness of ∼0.5 nm and a corrosion current of ∼50 μA/cm 2 . Our results suggest that, in the presence of H 2 O 2 , the Co film surface was covered with a passive film of CoO in acidic conditions and Co 3 O 4 in alkaline conditions. However, in the presence of H 2 O 2 and citric acid in acidic conditions, formation of the soluble complex [Co(C 6 H 5 O 7 ) 2 ] 3− from abraded Co enhanced the RRs significantly. The roles of H 2 O 2 , citric acid, and silica abrasives as well as the pH on the Co material removal process are discussed and a removal mechanism is proposed. Two inhibitors namely, 1, 2, 4-Triazole (TAZ) and Benzotriazole (BTA), were tested in the presence of 50 mM citric acid at pH 8 but were found to be ineffective even at concentrations of 100 mM in reducing the E corr of Co-Ti couple to minimize galvanic corrosion that is essential when the Co/Ti structure is polished after the removal of bulk of Co and requires further study. Sub-10 nm devices face several challenges with copper as an interconnect material for back-end-of-the-line (BEOL) processes during the manufacture of integrated circuits. These include increasing resistivity with decreasing thickness, 1 non-conformal deposition at narrow trench widths ∼20 nm or less, 2 and scaling limitations of the diffusion barrier/liner.3 This led to the investigation of new trench filling materials. Cobalt is a promising alternative to meet the challenges of interconnect lines at these lower nodes for the first two metal layers M1 and M2, due to its lower resistivity at smaller dimensions (∼10 nm) compared to copper. [4][5][6] Kamineni et al. 7 proposed the use of chemical vapor deposited (CVD) cobalt to replace the widely used tungsten for local interconnects for 10 nm and smaller nodes. They emphasized two main advantages of CVD Co metallization which are a) CVD Co precursors do not damage the Ti liner enabling barrier scaling and b) it achieves void free fill in high aspect ratio features without defects, something that is difficult to achieve with a conventional physical vapor deposited (PVD) Co process. 8,9 Hence, CVD-based Co metallization is an attractive option for the technology nodes below 10 nm.CVD-based cobalt has also gained prominence in the advanced copper interconnects below 22 nm as liner [10][11][12][13][14][15][16][17] to improve adhesion between the barrier (TaN, TiN) and Cu seed layer where the Co film thickness is only ∼2 nm. Several authors 18-26 have investigated cobalt polishing for such applications where RR requirements are typically <20 nm/min and Co loss due to corrosion has to be as close to zero as possible, since even a minute loss of Co material can degrade the device reliability significantly. Hence, since the potential gap between Co and Cu is a large ∼0...

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“…The casting method influences corrosion performance through controlling the microstructures. The presence of alloying elements with magnesium (Mg) not only modifies its mechanical properties but also improves its corrosion resistance [9].…”

Section: Introductionmentioning

confidence: 99%

Microstructure characterization and electrochemical corrosion behavior of Zn and Zn/Mg alloys in H2SO4 solution

Far

Rahimi²,

Chaghazardi³

et al. 2015

J. Cent. South Univ.

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The three systems of pure Zn, Zn−0.10% Mg (mass fraction), and Zn−0.15% Mg (mass fraction) were cast under controlled atmosphere and their microstructures were characterized by SEM/EDS analysis. The electrochemical corrosion behavior of these three samples was examined in the very aggressive solution of 50% H 2 SO 4 (mass fraction) using electrochemical impedance spectroscopy (EIS) and potentiodynamic polarization measurements. The results show that magnesium improves in some extent the corrosion resistance of pure Zn in 50% H 2 SO 4 (mass fraction) confirmed by EIS test. Results of polarization measurment also demonstrate that small amount of Mg significantly improves the passivation of Zn in the test solution. Results of surface morphology of the samples and EDS analysis reveal that Mg reduced the corrosion attacks to pure Zn.

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Electrochemical behavior of Mg and some Mg alloys in aqueous solutions of different pH

Cited by 75 publications

References 33 publications

Mg and Mg alloys: How comparable are in vitro and in vivo corrosion rates? A review

Mg and Mg alloys: How comparable are in vitro and in vivo corrosion rates? A review

Citric Acid as a Complexing Agent in Chemical Mechanical Polishing Slurries for Cobalt Films for Interconnect Applications

Microstructure characterization and electrochemical corrosion behavior of Zn and Zn/Mg alloys in H2SO4 solution

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