Electrochemical behavior of Sn-9Zn-xCu solder alloy in 3.5 wt% NaCl solution at room temperature

Study on the preparation and properties of Sn–0.7Cu–xBi alloy

“…Furthermore, before electrochemical impedance spectroscopy (EIS) measurement, an open circuit potential (OCP) test of 1800 s was conducted to conrm the stability of the working surface electrode. The polarization scanning range for this test was -1 V-1 V, with a scanning rate of 0.5 mV s −1 , 15,17 to obtain the potentiodynamic polarization curve of the alloy sample. Similarly, using CS Studio5 soware, the polarization curve was tted to obtain the self-correction potential (E corr ) and selfcorrection current density (j corr ).…”

“… 15 Similarly, Dheeraj et al examined the corrosion phenomenon of Sn–9Zn– x Cu solder alloy in 3.5 wt% NaCl solution, discussing the possible causes of Zn corrosion products and proposing accurate mechanisms. 17 Studies have shown that the addition of Bi to Sn–0.7Cu alloy affects the electrochemical performance of the alloy to a certain extent, with limited research in this area.…”

Effect of Al addition on microstructure and wetting properties of quinary lead-free solder alloy systems

“…In addition to these properties, melting temperature has critical importance. The optimum melting point of the produced lead-free solder alloys should not be high or low enough to cause heating problems [12]. Among the potential candidates presented as an alternative, low melting point solder alloys have attracted the attention of researchers [13].…”