Optimized conditions for Ti film electrodeposition were investigated in water-soluble KF-KCl (45:55 mol%) molten salt at 923 K. K 3 TiF 6 was prepared in the melt via a comproportionation reaction between K 2 TiF 6 and Ti sponges. The K 3 TiF 6 solubility was determined to be 1.48 mol%. Galvanostatic electrolysis was conducted on Ni plate substrates at various K 3 TiF 6 concentrations (0.28, 0.70, and 1.43 mol%) and current densities (25-150 mA cm −2). Surface and cross-sectional scanning electron microscopy observations showed that adherent, compact, and smooth Ti films were obtained at higher K 3 TiF 6 concentrations and lower current densities. A corrosion test was conducted for the Ti-coated Ni plate using linear sweep voltammetry, which showed that the Ti films have no cracks or voids.