Electrochemical copper deposition on Au(100): a combined in situ STM and in situ surface X-ray diffraction study

Randler, R.; Kolb, Dieter M.; Ocko, B. M.; Robinson, Ian

doi:10.1016/s0039-6028(99)01170-x

Cited by 65 publications

(44 citation statements)

References 27 publications

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“…A qualitative fit (MSE = 5.7) was obtained for 0.17 -0.18 nm adlayer thickness. In spite of the model crudeness, this value compares well with the spacing between the gold surface and first copper layer, 1.74 ± 0.1Å reported in literature [22]. Indeed, a close look to data and simulations through difference spectra (insets of Fig.…”

Section: Resultssupporting

confidence: 89%

Cu underpotential deposition on Au controlled by in situ Spectroscopic Ellipsometry

Prato

Gussoni

Panizza

et al. 2008

Phys. Status Solidi (c)

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We have studied Cu electrodeposition on well defined Au films using real time Spectroscopic Ellipsometry (SE). SE allows to discriminate the under‐potential (UP) and over‐potential (OP) regimes. In the UP regime, tiny yet reproducible variations of Ψ and Δ parameters indicate the formation of two phases with slightly different optical behavior. The phase at the largest coverage is assigned to a Cu monolayer. The SE response in the OP regime shows a marked dependence on the potential scan rate. (© 2008 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)

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Section: Resultssupporting

confidence: 89%

Cu underpotential deposition on Au controlled by in situ Spectroscopic Ellipsometry

Prato

Gussoni

Panizza

et al. 2008

Phys. Status Solidi (c)

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“…spiral dislocations, do not disappear [43], the discharge of copper continues. Direct STM evidence for the involvement of surface defects in the initial stages of metal electrodeposition processes has been reported by Kolb and coworkers [44]. Electrodeposited copper is well known [13] to be an active state of the metal, i.e.…”

Section: Electrodeposition Of Coppermentioning

confidence: 99%

Involvement of a metastable surface state in the electrocatalytic, electrodeposition and bath additive behaviour of copper in acid solution

et al. 2006

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Copper in aqueous sulphuric acid solution at room temperature displays a low level active (metastable) surface state redox transition well within the double layer region, at ca. )0.7±0.1 V (SMSE). The latter is an important feature of this electrode system as it apparently coincides with (a) the transition from activation to transport control in acid sulphate copper plating baths, (b) a major change in the inhibiting properties of several plating bath additives, and (c) the onset/termination potential of electrocatalytic processes, e.g. nitrate reduction, at copper in acid. The nature and influence of this active surface state behaviour, which is assumed to be relevant to Damascene copper plating, is discussed.

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“…A variety of in situ techniques are now available, including the electrochemical quartz crystal microbalance (EQCM), [1][2][3] electrochemical scanning tunnelling microscopy (STM) 4,5 and scanning electrochemical microscopy (SECM). [6][7][8][9][10] The SECM is a scanning probe microscopy (SPM), and as all SPMs, they operate by scanning or "rastering" a small probe tip over a surface to be investigated.…”

Section: Introductionmentioning

confidence: 99%

Scanning electrochemical microscopy: study of the deposition and stripping mechanism of lead in the presence of copper

Sousa¹,

Sánchez²,

Bertazzoli³

2011

J. Braz. Chem. Soc.

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Este artigo descreve a utilização da microscopia eletroquímica de varredura (SECM) no modo geração pelo substrato/coleta pela ponta (SG/TC), com o objetivo de elucidar aspectos mecanísticos da deposição eletrolítica e redissolução anódica de íons Pb 2+ na presença de Cu 2+, utilizando-se um eletrodo de carbono vítreo como substrato. Um pico anódico foi observado entre os principais picos correspondentes à redissolução dos metais puros. A posição, intensidade e forma deste pico foram investigadas e foi verificado que eram função da razão entre as concentrações de Pb 2+ e Cu 2+. Os resultados sugerem que o pico é devido à dissolução do chumbo depositado sobre cobre, resultante de uma deposição em regime de subtensão. A SECM forneceu informações adicionais para o entendimento dos mecanismos de redissolução que não seriam obtidas a partir da análise apenas da resposta voltamétrica. This paper describes the application of scanning electrochemical microscopy (SECM) in the substrate-generation/tip-collection (SG/TC) mode to elucidate mechanistic aspects of the deposition and stripping of Pb 2+ ions in the presence of Cu 2+ into a glassy carbon substrate electrode. A stripping peak was observed between the main peaks corresponding to the pure metals. Its position, height and shape were investigated, and the peak intensity was found to depend on the Pb 2+ /Cu 2+ concentration ratio. The results suggested that this peak was due to the dissolution of lead deposited in copper, as a result of an underpotential deposition. The scanning electrochemical microscope provided additional information towards the understanding of the stripping mechanisms in analytical studies. In particular, the SECM-tip response yielded direct evidence about the speciation of some of the compounds evolved during stripping. This information was not available from the voltammetric response of the substrate electrode alone.

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Electrochemical copper deposition on Au(100): a combined in situ STM and in situ surface X-ray diffraction study

Cited by 65 publications

References 27 publications

Cu underpotential deposition on Au controlled by in situ Spectroscopic Ellipsometry

Cu underpotential deposition on Au controlled by in situ Spectroscopic Ellipsometry

Involvement of a metastable surface state in the electrocatalytic, electrodeposition and bath additive behaviour of copper in acid solution

Scanning electrochemical microscopy: study of the deposition and stripping mechanism of lead in the presence of copper

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