Electrochemical Corrosion Behaviour of Pb-free SAC 105 and SAC 305 Solder Alloys: A Comparative Study

Fayeka, M.; Haseeb, A.S.M.A.; Fazal, M. A.

doi:10.17576/jsm-2017-4602-14

JSM

2017

DOI: 10.17576/jsm-2017-4602-14

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Electrochemical Corrosion Behaviour of Pb-free SAC 105 and SAC 305 Solder Alloys: A Comparative Study

M. Fayeka¹,

A.S.M.A. Haseeb²,

M. A. Fazal³

Abstract: Sn-Ag based solder alloy seems to be a promising lead-free solder for the application on electronic assembly. The corrosion behavior of different lead free solder alloys such as Aloi pateri berasaskan Sn-Ag berpotensi menjadi pateri bebas-Pb untuk diaplikasikan sebagai pemasangan elektronik. Tindak balas kakisan aloi pateri bebas Pb yang berbeza seperti dikaji dalam larutan 3.5% NaCl menggunakan upaya dinamik pengutuban dan spektroskopi impedans elektrokimia. Mikroskop imbasan elektron (SEM), spektroskop… Show more

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Cited by 21 publications

References 27 publications

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Interfacial reaction on different solder composition after laser soldering

Muhamad Razizy,

Saliza Azlina,

Farazila

2024

Materialwissenschaft Werkst

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This study used electroless nickel‐immersion gold surface finish. The lead free solder used are tin‐silver‐copper 305 and tin‐silver‐copper 307 solder alloys. The difference in copper composition will affect the intermetallic compound′s microstructure after the laser soldering process. The intermetallic compound formation analysis reveals that only (Cu, Ni)6Sn5 was observed at the solder joint interface for both solders after laser soldering. The grain microstructure of tin‐silver‐copper 305 formed is rounded‐shaped and bar‐shaped, while tin‐silver‐copper 307 shapes are oval‐shaped and flake‐like. However, for cross‐sectioned analysis, the intermetallic compound grain microstructure formed at the solder joint formation was (Ni, Cu)3Sn4 and (Cu, Ni)6Sn5 presented in dendrite‐like and scale‐like shapes. This result shows that copper content in solder composition is directly affected the intermetallic compound grain microstructure. When exposed to the ageing process, the intermetallic compound thickness will increase directly with ageing time. The intermetallic compound thickness for tin‐silver‐copper 305 was increased from 0.98 μm to 8.34 μm while tin‐silver‐copper 307 was increased from 1.54 μm to 8.76 μm. The result also shows that nano‐sized of Ag3Sn grain particle was formed on the intermetallic compound surface after an ageing process for both samples, tin‐silver‐copper 305 and tin‐silver‐copper 307.

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Interfacial reaction on different solder composition after laser soldering

Muhamad Razizy,

Saliza Azlina,

Farazila

2024

Materialwissenschaft Werkst

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Effect of Zn incorporation on the electrochemical corrosion properties of SAC105 solder alloys

Liyana

Fazal

Haseeb

et al. 2019

J Mater Sci: Mater Electron

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Effect of polyvinyl chloride fire smoke on the long-term corrosion kinetics and surface microstructure of tin–lead and lead-free solders

Lin

et al. 2019

J Mater Sci: Mater Electron

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Electrochemical Corrosion Behaviour of Pb-free SAC 105 and SAC 305 Solder Alloys: A Comparative Study

Cited by 21 publications

References 27 publications

Interfacial reaction on different solder composition after laser soldering

Interfacial reaction on different solder composition after laser soldering

Effect of Zn incorporation on the electrochemical corrosion properties of SAC105 solder alloys

Effect of polyvinyl chloride fire smoke on the long-term corrosion kinetics and surface microstructure of tin–lead and lead-free solders

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